公开(公告)号：US20170373237A1

公开(公告)日：2017-12-28

申请号：US15538048

申请日：2015-12-30

Applicant: Axel MEHNERT ,  Dusan UBOVIC ,  Marcus Frannciscus DONKER ,  Hendrik Jan EGGINK ,  Rene VAN HON-SCHOOTEN ,  Theodoor TREURNIET ,  KONINKLIJKE PHILIPS N.V.

Inventor： Axel Mehnert ,  Dusan Golubovic ,  Marcus Franciscus Donker ,  Hendrik Jan Eggink ,  Rene Van Honschooten ,  Theodoor Cornelis Treurniet

IPC: H01L33/64

CPC classification number: H01L33/642 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

公开(公告)号：US20170006710A1

公开(公告)日：2017-01-05

申请号：US15103991

申请日：2014-12-16

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Frederic Stephane Diana ,  Patrick Allen Bournes ,  Walter Daeschner ,  Yong Seok Choi ,  Axel Mehnert ,  Mohiuddin Mala

IPC: H05K3/30 ,  H05K3/04

CPC classification number: H05K3/303 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/005 ,  H05K3/04 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2203/175 ,  H01L2924/00

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract translation: 柔性基板上的图案化导电层包括用于安装LED阵列，导电条和将导电条耦合到焊盘的导电突片的焊盘。 所需的电路配置是通过在突片的位置处冲孔或以其他方式刺穿柔性基板来移除选择的突片来产生的。 在一些实施例中，图案化导电层被布置成允许每个LED被安装在两个镜像取向中的任一个中，并且在一些实施例中，图案化导电层被布置成允许未由图案预定义的LED之间的间隔。 在一些实施例中，未修改的图案化导电层被布置成提供并联电路配置，并且经修改的图案化导电层被布置成提供串联或串联并联配置。