公开(公告)号：US20170006710A1

公开(公告)日：2017-01-05

申请号：US15103991

申请日：2014-12-16

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Frederic Stephane Diana ,  Patrick Allen Bournes ,  Walter Daeschner ,  Yong Seok Choi ,  Axel Mehnert ,  Mohiuddin Mala

IPC: H05K3/30 ,  H05K3/04

CPC classification number: H05K3/303 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K1/189 ,  H05K3/005 ,  H05K3/04 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2203/175 ,  H01L2924/00

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract translation: 柔性基板上的图案化导电层包括用于安装LED阵列，导电条和将导电条耦合到焊盘的导电突片的焊盘。 所需的电路配置是通过在突片的位置处冲孔或以其他方式刺穿柔性基板来移除选择的突片来产生的。 在一些实施例中，图案化导电层被布置成允许每个LED被安装在两个镜像取向中的任一个中，并且在一些实施例中，图案化导电层被布置成允许未由图案预定义的LED之间的间隔。 在一些实施例中，未修改的图案化导电层被布置成提供并联电路配置，并且经修改的图案化导电层被布置成提供串联或串联并联配置。

公开(公告)号：US10379263B2

公开(公告)日：2019-08-13

申请号：US15110840

申请日：2015-01-04

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: F21V5/00 ,  G02B3/00 ,  H01L33/58 ,  F21V17/10 ,  F21V19/00 ,  G02B19/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

公开(公告)号：US20160341852A1

公开(公告)日：2016-11-24

申请号：US15110840

申请日：2015-01-04

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: G02B3/00 ,  F21V5/00 ,  F21V19/00 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  G02B19/00 ,  F21V17/10

CPC classification number: G02B3/0075 ,  F21V5/007 ,  F21V17/101 ,  F21V19/002 ,  G02B3/0056 ,  G02B19/0066 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

Abstract translation: 透镜结构预先形成有促进透镜结构内的发光芯片精确对准的特征。 为了简化制造，这些特征包括锥形壁，其允许将发光芯片容易地插入到透镜结构中，锥形用于在芯片完全插入时精确对准发光芯片。 锥形可以包括线性倾斜或弯曲的壁，包括复杂的形状。 可以使用粘合剂将发光芯片固定到透镜结构。 发光芯片可以被拾取并放置在透镜结构的阵列中，或者拾取并放置在可被透镜结构阵列覆盖的衬底上。