-
公开(公告)号：US10533953B2
公开(公告)日：2020-01-14
申请号：US15388577
申请日：2016-12-22
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang
Abstract: A method includes receiving one or more images of three or more die of a wafer, determining a median intensity value of a set of pixel intensity values acquired from a same location on each of the three or more die, determining a difference intensity value for the set of pixel intensity values by comparing the median intensity value of the set of pixel intensity values to each pixel intensity value, grouping the pixel intensity values into an intensity bin based on the median intensity value of the set of pixel intensity values, generating an initial noise boundary based on a selected difference intensity value in the intensity bin, generating a final noise boundary by adjusting the initial noise boundary, generating a detection boundary by applying a threshold to the final noise boundary, and classifying one or more pixel intensity values outside the detection boundary as a defect.
-
公开(公告)号：US10402963B2
公开(公告)日：2019-09-03
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
-
公开(公告)号：US20190066284A1
公开(公告)日：2019-02-28
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
CPC classification number: G06T7/001 , G06K9/00 , G06T5/50 , G06T7/136 , G06T7/55 , G06T2207/10056 , G06T2207/20152 , G06T2207/20224
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
-
公开(公告)号：US10043265B2
公开(公告)日：2018-08-07
申请号：US15221542
申请日：2016-07-27
Applicant: KLA-Tencor Corporation
Inventor： Tong Huang , Xuguang Jiang , Yong Zhang
IPC: G06T7/00
Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.
-
Patent Agency Ranking
公开(公告)号：US10372113B2
公开(公告)日：2019-08-06
申请号：US15669030
申请日：2017-08-04
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Shifang Li , Yong Zhang
IPC: G06F17/50 , G05B19/418 , G06T7/00 , G06T7/11 , G06T7/174
Abstract: Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color combination, and obtain defocus detection threshold. This can include applying a segment mask, calculating mean intensities of the segment, determining a color combination that optimizes defocus sensitivity, and generating a second segment mask based on pixels that are above a threshold to sensitivity. In a detection step, the selected color combination is calculated, and the threshold is applied to obtain defocus detection result.
-
6.发明授权公开(公告)号：US10324046B1
公开(公告)日：2019-06-18
申请号：US15241005
申请日：2016-08-18
Applicant: KLA-Tencor Corporation
Inventor： Tao-Yi Fu , Steve Lange , Lisheng Gao , Xuguang Jiang , Ping Gu , Sylvain Muckenhirn
Abstract: Methods and systems for monitoring a non-defect related characteristic of a patterned wafer are provided. One computer-implemented method includes generating output responsive to light from a patterned wafer using an inspection system. The method also includes determining differences between a value of a non-defect related characteristic of the patterned wafer and a known value of the non-defect related characteristic based on differences between one or more attributes of the output and one or more attributes of other output of the inspection system for a different patterned wafer having the known value of the non-defect related characteristic.
-
公开(公告)号：US20180088560A1
公开(公告)日：2018-03-29
申请号：US15669030
申请日：2017-08-04
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Shifang Li , Yong Zhang
IPC: G05B19/418 , G06T7/00
CPC classification number: G05B19/418 , G05B2219/45027 , G05B2219/45031 , G06T7/0004 , G06T7/11 , G06T7/174 , G06T2207/10024 , G06T2207/10148 , G06T2207/10152 , G06T2207/30148 , G06T2207/30168
Abstract: Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color combination, and obtain defocus detection threshold. This can include applying a segment mask, calculating mean intensities of the segment, determining a color combination that optimizes defocus sensitivity, and generating a second segment mask based on pixels that are above a threshold to sensitivity. In a detection step, the selected color combination is calculated, and the threshold is applied to obtain defocus detection result.
-
公开(公告)号：US20170284944A1
公开(公告)日：2017-10-05
申请号：US15388577
申请日：2016-12-22
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang
Abstract: A method includes receiving one or more images of three or more die of a wafer, determining a median intensity value of a set of pixel intensity values acquired from a same location on each of the three or more die, determining a difference intensity value for the set of pixel intensity values by comparing the median intensity value of the set of pixel intensity values to each pixel intensity value, grouping the pixel intensity values into an intensity bin based on the median intensity value of the set of pixel intensity values, generating an initial noise boundary based on a selected difference intensity value in the intensity bin, generating a final noise boundary by adjusting the initial noise boundary, generating a detection boundary by applying a threshold to the final noise boundary, and classifying one or more pixel intensity values outside the detection boundary as a defect.
-
9.发明申请公开(公告)号：US20170270652A1
公开(公告)日：2017-09-21
申请号：US15221542
申请日：2016-07-27
Applicant: KLA-Tencor Corporation
Inventor： Tong Huang , Xuguang Jiang , Yong Zhang
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2207/20224 , G06T2207/30148
Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.015 seconds)
