公开(公告)号：US10324046B1

公开(公告)日：2019-06-18

申请号：US15241005

申请日：2016-08-18

Applicant: KLA-Tencor Corporation

Inventor： Tao-Yi Fu ,  Steve Lange ,  Lisheng Gao ,  Xuguang Jiang ,  Ping Gu ,  Sylvain Muckenhirn

IPC: G01N21/00 ,  G01N21/95 ,  G01B11/30 ,  G01N21/956 ,  G01N21/88 ,  H01L21/66

Abstract: Methods and systems for monitoring a non-defect related characteristic of a patterned wafer are provided. One computer-implemented method includes generating output responsive to light from a patterned wafer using an inspection system. The method also includes determining differences between a value of a non-defect related characteristic of the patterned wafer and a known value of the non-defect related characteristic based on differences between one or more attributes of the output and one or more attributes of other output of the inspection system for a different patterned wafer having the known value of the non-defect related characteristic.