公开(公告)号：US10067072B2

公开(公告)日：2018-09-04

申请号：US15201191

申请日：2016-07-01

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Jason C. Kirkwood

IPC: G06K9/00 ,  G01N21/95 ,  H04N5/225 ,  G01N21/88

Abstract: A system for detecting defects on a semiconductor sample includes an illumination module for directing a nonzero-order Gaussian illumination beam towards a plurality of locations on a sample and a collection module for detecting light scattered from the sample in response to the nonzero-order Gaussian illumination beams and generating a plurality of output images or signals for each location on the sample. The system further comprises a processor system for detecting defects by (i) processing the output images or signals so as to retain filtered image or signal portions that substantially match a point spread function of the one or more nonzero-order Gaussian illumination beams, and (ii) analyzing the filtered image or signal portions to detect defects on the sample.

公开(公告)号：US11668655B2

公开(公告)日：2023-06-06

申请号：US16272528

申请日：2019-02-11

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Grace H. Chen ,  Amrit Poudel ,  Mark S. Wang

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8874 ,  G01N2021/8887

Abstract: A semiconductor-inspection tool scans a semiconductor die using a plurality of optical modes. A plurality of defects on the semiconductor die are identified based on results of the scanning. Respective defects of the plurality of defects correspond to respective pixel sets of the semiconductor-inspection tool. The scanning fails to resolve the respective defects. The results include multi-dimensional data based on pixel intensity for the respective pixel sets, wherein each dimension of the multi-dimensional data corresponds to a distinct mode of the plurality of optical modes. A discriminant function is applied to the results to transform the multi-dimensional data for the respective pixel sets into respective scores. Based at least in part on the respective scores, the respective defects are divided into distinct classes.

公开(公告)号：US20150293035A1

公开(公告)日：2015-10-15

申请号：US14682822

申请日：2015-04-09

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Nisha Amthul

IPC: G01N21/95 ,  G01N21/47 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2201/10

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes an illumination subsystem configured to direct light to at least one spot on a wafer. The system also includes at least one element configured to block first portion(s) of light scattered from the at least one spot from reaching a detector while allowing second portion(s) of the light scattered from the at least one spot to be detected by the detector. The first portion(s) of the light are scattered from one or more patterned features in a logic region on the wafer. The second portion(s) of the light are not scattered from the one or more patterned features. The detector is not an imaging detector. The system further includes a computer subsystem configured to detect defects on the wafer based on output of the detector.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为将光引导到晶片上的至少一个点的照明子系统。 该系统还包括至少一个元件，其构造成阻挡从至少一个点散射的光的第一部分到达检测器，同时允许从至少一个点散射的光的第二部分被 检测器。 光的第一部分从晶片上的逻辑区域中的一个或多个图案特征散射。 光的第二部分不从一个或多个图案特征散射。 检测器不是成像检测器。 该系统还包括被配置为基于检测器的输出来检测晶片上的缺陷的计算机子系统。

公开(公告)号：US20200025689A1

公开(公告)日：2020-01-23

申请号：US16272528

申请日：2019-02-11

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Grace H. Chen ,  Amrit Poudel ,  Mark S. Wang

IPC: G01N21/88 ,  G01N21/95

Abstract: A semiconductor-inspection tool scans a semiconductor die using a plurality of optical modes. A plurality of defects on the semiconductor die are identified based on results of the scanning. Respective defects of the plurality of defects correspond to respective pixel sets of the semiconductor-inspection tool. The scanning fails to resolve the respective defects. The results include multi-dimensional data based on pixel intensity for the respective pixel sets, wherein each dimension of the multi-dimensional data corresponds to a distinct mode of the plurality of optical modes. A discriminant function is applied to the results to transform the multi-dimensional data for the respective pixel sets into respective scores. Based at least in part on the respective scores, the respective defects are divided into distinct classes.

公开(公告)号：US20170011495A1

公开(公告)日：2017-01-12

申请号：US15201191

申请日：2016-07-01

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Jason C. Kirkwood

IPC: G06T5/00

CPC classification number: G01N21/9501 ,  G01N2021/8822 ,  H04N5/2256

Abstract: Disclosed are apparatus and methods for detecting defects on a semiconductor sample. The system includes an illumination module for directing a nonzero-order Gaussian illumination beam towards a plurality of locations on a sample and a collection module for detecting light scattered from the sample in response to the nonzero-order Gaussian illumination beams and generating a plurality of output images or signals for each location on the sample. The system further comprises a processor system for detecting defects by (i) processing the output images or signals so as to retain filtered image or signal portions that substantially match a point spread function of the one or more nonzero-order Gaussian illumination beams, and (ii) analyzing the filtered image or signal portions to detect defects on the sample.

Abstract translation: 公开了用于检测半导体样品上的缺陷的装置和方法。 该系统包括用于将非零阶高斯照明光束引导到样本上的多个位置的照明模块和用于响应于非零阶高斯照明光束检测从样本散射的光的收集模块，并且生成多个输出 样品上每个位置的图像或信号。 该系统还包括一种用于通过（i）处理输出图像或信号来检测缺陷的处理器系统，以便保持基本上与一个或多个非零阶高斯照明光束的点扩散函数基本匹配的滤波图像或信号部分，以及（ ii）分析滤波图像或信号部分以检测样品上的缺陷。

公开(公告)号：US09506873B2

公开(公告)日：2016-11-29

申请号：US14682822

申请日：2015-04-09

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Nisha Amthul

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2201/10

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes an illumination subsystem configured to direct light to at least one spot on a wafer. The system also includes at least one element configured to block first portion(s) of light scattered from the at least one spot from reaching a detector while allowing second portion(s) of the light scattered from the at least one spot to be detected by the detector. The first portion(s) of the light are scattered from one or more patterned features in a logic region on the wafer. The second portion(s) of the light are not scattered from the one or more patterned features. The detector is not an imaging detector. The system further includes a computer subsystem configured to detect defects on the wafer based on output of the detector.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为将光引导到晶片上的至少一个点的照明子系统。 该系统还包括至少一个元件，其构造成阻挡从至少一个点散射的光的第一部分到达检测器，同时允许从至少一个点散射的光的第二部分被 检测器。 光的第一部分从晶片上的逻辑区域中的一个或多个图案特征散射。 光的第二部分不从一个或多个图案特征散射。 检测器不是成像检测器。 该系统还包括被配置为基于检测器的输出来检测晶片上的缺陷的计算机子系统。