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公开(公告)号：US11441893B2
公开(公告)日：2022-09-13
申请号：US16018355
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Prasanna Dighe , Dieter Mueller , Dong Chen , Dengpeng Chen , Steve Zamek , Daniel Kavaldjiev , Alexander Buettner
Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.
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公开(公告)号：US20190331592A1
公开(公告)日：2019-10-31
申请号：US16018355
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Prasanna Dighe , Dieter Mueller , Dong Chen , Dengpeng Chen , Steve Zamek , Daniel Kavaldjiev , Alexander Buettner
Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.
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Patent Agency Ranking
公开(公告)号：US11164768B2
公开(公告)日：2021-11-02
申请号：US16019341
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Pradeep Vukkadala , Mark D. Smith , Ady Levy , Prasanna Dighe , Dieter Mueller
Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.
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4.发明授权Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control 有权反馈前馈和反馈校正的统计叠加误差预测，根本原因分析和过程控制公开(公告)号：US09087176B1
公开(公告)日：2015-07-21
申请号：US14220665
申请日：2014-03-20
Applicant: KLA-Tencor Corporation
Inventor： Wei Chang , Krishna Rao , Joseph Gutierrez , Ramon Olavarria , Craig Macnaughton , Amir Azordegan , Prasanna Dighe , Jaydeep Sinha
CPC classification number: G03F7/705 , G03F1/144 , G03F1/36 , G03F7/70633 , G06F17/5068 , G06F17/5081 , G06F2217/12 , G06N5/04 , G06N99/005 , Y02P90/265
Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.
Abstract translation: 收集数据和训练，验证和部署统计模型以使用图案化晶片几何数据和其他相关信息来预测覆盖误差的方法包括选择训练晶片组，在多个光刻步骤测量并计算几何差异，将多个预测模型应用于 训练晶片几何差异并将预测覆盖与训练晶片组上测量的覆盖层进行比较。 识别最准确的预测模型，并将结果反馈到光刻扫描仪工具，可以校正这些影响并减少晶片扫描和曝光过程中的重叠误差。
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公开(公告)号：US10545412B2
公开(公告)日：2020-01-28
申请号：US15123980
申请日：2015-03-05
Applicant: KLA-Tencor Corporation
Inventor： Wei Chang , Krishna Rao , Joseph Gutierrez , Ramon Olavarria , Craig MacNaughton , Amir Azordegan , Prasanna Dighe
Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.
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6.发明申请Statistical Overlay Error Prediction for Feed Forward and Feedback Correction of Overlay Errors, Root Cause Analysis and Process Control 审中-公开统计叠加误差预测的前馈和反馈校正重叠错误，根本原因分析和过程控制公开(公告)号：US20170017162A1
公开(公告)日：2017-01-19
申请号：US15123980
申请日：2015-03-05
Applicant: KLA-Tencor Corporation
Inventor： Wei Chang , Krishna Rao , Joseph Gutierrez , Ramon Olavarria , Craig MacNaughton , Amir Azordegan , Prasanna Dighe
CPC classification number: G03F7/705 , G03F1/144 , G03F1/36 , G03F7/70633 , G06F17/5068 , G06F17/5081 , G06F2217/12 , G06N5/04 , G06N20/00 , Y02P90/265
Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.
Abstract translation: 收集数据和训练，验证和部署统计模型以使用图案化晶片几何数据和其他相关信息来预测覆盖误差的方法包括选择训练晶片组，在多个光刻步骤测量并计算几何差异，将多个预测模型应用于 训练晶片几何差异并将预测覆盖与训练晶片组上测量的覆盖层进行比较。 识别最准确的预测模型，并将结果反馈到光刻扫描仪工具，可以校正这些影响并减少晶片扫描和曝光过程中的重叠误差。
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公开(公告)号：US20190333794A1
公开(公告)日：2019-10-31
申请号：US16019341
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Pradeep Vukkadala , Mark D. Smith , Ady Levy , Prasanna Dighe , Dieter Mueller
IPC: H01L21/67 , G01B11/06 , G01N21/45 , G05B19/4097 , G03F7/20
Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.
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