公开(公告)号：US11441893B2

公开(公告)日：2022-09-13

申请号：US16018355

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

IPC: G01B11/06 ,  G02B6/36

Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

公开(公告)号：US20190331592A1

公开(公告)日：2019-10-31

申请号：US16018355

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Prasanna Dighe ,  Dieter Mueller ,  Dong Chen ,  Dengpeng Chen ,  Steve Zamek ,  Daniel Kavaldjiev ,  Alexander Buettner

IPC: G01N21/27 ,  G01N21/21 ,  G01N21/95 ,  G03F7/20

Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

公开(公告)号：US09273952B2

公开(公告)日：2016-03-01

申请号：US14338091

申请日：2014-07-22

Applicant: KLA-Tencor Corporation

Inventor： Dieter Mueller ,  Rainer Schierle ,  Daniel Ivanov Kavaldjiev

IPC: G01B9/02 ,  G01B11/06 ,  G01N21/95

CPC classification number: G01B11/06 ,  G01B9/02021 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01B2290/30 ,  G01N21/9501

Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.

Abstract translation: 提供了用于检查诸如半导体晶片的样本的系统。 该系统使用衍射光栅扫描双面样品，该衍射光栅将第n阶（n> 0）波阵面扩大并通过到样品表面，以及光束每个通道的反射表面。 优选地使用两个通道和两个反射表面，并且使用第二衍射光栅将波前组合并传递到具有期望的纵横比的相机系统。 该系统优选地包括滤波不需要的声波和地震振动的阻尼装置，包括扫描样本的第一部分的光学装置和用于将样本平移或旋转到平行或旋转装置的位置，其中光学装置可以扫描剩余的 样本的一部分。 该系统还包括用于将扫描拼接在一起的装置，为更小且更便宜的光学元件提供。

公开(公告)号：US11164768B2

公开(公告)日：2021-11-02

申请号：US16019341

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Pradeep Vukkadala ,  Mark D. Smith ,  Ady Levy ,  Prasanna Dighe ,  Dieter Mueller

IPC: H01L21/67 ,  H01L21/66 ,  G01B11/06 ,  G01N21/45 ,  G03F7/20 ,  G05B19/4097

Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.

公开(公告)号：US20140333937A1

公开(公告)日：2014-11-13

申请号：US14338091

申请日：2014-07-22

Applicant: KLA-Tencor Corporation

Inventor： Dieter Mueller ,  Rainer Schierle ,  Daniel Ivanov Kavaldjiev

IPC: G01B11/06

CPC classification number: G01B11/06 ,  G01B9/02021 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/0675 ,  G01B2210/56 ,  G01B2290/30 ,  G01N21/9501

Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.

Abstract translation: 提供了用于检查诸如半导体晶片的样本的系统。 该系统使用衍射光栅扫描双面样品，该衍射光栅将第n阶（n> 0）波阵面扩大并通过到样品表面，以及光束每个通道的反射表面。 优选地使用两个通道和两个反射表面，并且使用第二衍射光栅将波前组合并传递到具有期望的纵横比的相机系统。 该系统优选地包括滤波不需要的声波和地震振动的阻尼装置，包括扫描样本的第一部分的光学装置和用于将样本平移或旋转到平行或旋转装置的位置，其中光学装置可以扫描剩余的 样本的一部分。 该系统还包括用于将扫描拼接在一起的装置，为更小且更便宜的光学元件提供。

公开(公告)号：US20190333794A1

公开(公告)日：2019-10-31

申请号：US16019341

申请日：2018-06-26

Applicant: KLA-Tencor Corporation

Inventor： Pradeep Vukkadala ,  Mark D. Smith ,  Ady Levy ,  Prasanna Dighe ,  Dieter Mueller

IPC: H01L21/67 ,  G01B11/06 ,  G01N21/45 ,  G05B19/4097 ,  G03F7/20

Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.