公开(公告)号：US11798827B2

公开(公告)日：2023-10-24

申请号：US17333770

申请日：2021-05-28

Applicant: KLA Corporation

Inventor： Robert J. Rathert ,  David W. Price ,  Chet V. Lenox ,  Oreste Donzella ,  Kara L. Sherman ,  John Robinson

IPC: H01L21/67 ,  G05B19/418 ,  G01R31/26

CPC classification number: H01L21/67288 ,  G01R31/2601 ,  G05B19/41875 ,  G05B2219/45031

Abstract: Systems and methods for semiconductor adaptive testing using inline defect part average testing are configured to receive a plurality of inline defect part average testing (I-PAT) scores from an I-PAT system, where the plurality of I-PAT scores is generated by the I-PAT system based on semiconductor die data for a plurality of semiconductor dies, where the semiconductor die data includes characterization measurements for the plurality of semiconductor dies, where each I-PAT score of the plurality of I-PAT scores represents a weighted defectivity determined by the I-PAT system based on a characterization measurement of a corresponding semiconductor die of the plurality of semiconductor dies; apply one or more rules to the plurality of I-PAT scores during a dynamic decision-making process; and generate one or more adaptive tests for at least one semiconductor die of the plurality of semiconductor dies based on the dynamic decision-making process.

公开(公告)号：US20230236132A1

公开(公告)日：2023-07-27

申请号：US17732212

申请日：2022-04-28

Applicant: KLA Corporation

Inventor： David W. Price ,  Robert J. Rathert ,  Chet V. Lenox ,  Oreste Donzella ,  Justin Lach ,  John Robinson

IPC: G01N21/88 ,  H01L21/66 ,  G01N21/95 ,  G03F7/20

CPC classification number: G01N21/8851 ,  H01L22/12 ,  G01N21/9501 ,  H01L22/14 ,  G03F7/7065 ,  G01N2021/8854

Abstract: Systems and methods for determining a diagnosis of a screening system are disclosed. Such systems and methods include identifying defect results based on inline characterization tool data, identifying electrical test results based on electrical test data, generating one or more correlation metrics based on the defect results and the electrical test results, and determining at least one diagnosis of the screening system based on the one or more correlation metrics, the diagnosis corresponding to a performance of the screening system.

公开(公告)号：US20220196723A1

公开(公告)日：2022-06-23

申请号：US17321263

申请日：2021-05-14

Applicant: KLA Corporation

Inventor： David W. Price ,  Robert J. Rathert ,  Chet V. Lenox ,  Kara L. Sherman ,  Teng Song Lim ,  Thomas Groos ,  Mike Von Den Hoff ,  Oreste Donzella ,  Narayani Narasimhan ,  Barry Saville ,  Justin Lach ,  John Robinson

IPC: G01R31/26 ,  H01L21/66

Abstract: Automatically identifying defect-based test coverage gaps in semiconductor devices includes determining a plurality of apparent killer defects on one or more semiconductor devices with a plurality of semiconductor dies based on characterization measurements of the one or more semiconductor devices acquired by one or more semiconductor fabrication subsystems, determining at least one semiconductor die which passes at least one test based on test measurements acquired by one or more test tool subsystems, correlate the characterization measurements with the test measurements to determine at least one apparent killer defect on the at least one semiconductor die which passes the at least one test, and determining one or more gap areas on the one or more semiconductor devices for defect-based test coverage based on the at least one apparent killer defect on the at least one semiconductor die which passes the at least one test.

公开(公告)号：US20220359247A1

公开(公告)日：2022-11-10

申请号：US17333770

申请日：2021-05-28

Applicant: KLA Corporation

Inventor： Robert J. Rathert ,  David W. Price ,  Chet V. Lenox ,  Oreste Donzella ,  Kara L. Sherman ,  John Robinson

IPC: H01L21/67 ,  G05B19/418 ,  G01R31/26

Abstract: Systems and methods for semiconductor adaptive testing using inline defect part average testing are configured to receive a plurality of inline defect part average testing (I-PAT) scores from an I-PAT system, where the plurality of I-PAT scores is generated by the I-PAT system based on semiconductor die data for a plurality of semiconductor dies, where the semiconductor die data includes characterization measurements for the plurality of semiconductor dies, where each I-PAT score of the plurality of I-PAT scores represents a weighted defectivity determined by the I-PAT system based on a characterization measurement of a corresponding semiconductor die of the plurality of semiconductor dies; apply one or more rules to the plurality of I-PAT scores during a dynamic decision-making process; and generate one or more adaptive tests for at least one semiconductor die of the plurality of semiconductor dies based on the dynamic decision-making process.