公开(公告)号：US20220196723A1

公开(公告)日：2022-06-23

申请号：US17321263

申请日：2021-05-14

Applicant: KLA Corporation

Inventor： David W. Price ,  Robert J. Rathert ,  Chet V. Lenox ,  Kara L. Sherman ,  Teng Song Lim ,  Thomas Groos ,  Mike Von Den Hoff ,  Oreste Donzella ,  Narayani Narasimhan ,  Barry Saville ,  Justin Lach ,  John Robinson

IPC: G01R31/26 ,  H01L21/66

Abstract: Automatically identifying defect-based test coverage gaps in semiconductor devices includes determining a plurality of apparent killer defects on one or more semiconductor devices with a plurality of semiconductor dies based on characterization measurements of the one or more semiconductor devices acquired by one or more semiconductor fabrication subsystems, determining at least one semiconductor die which passes at least one test based on test measurements acquired by one or more test tool subsystems, correlate the characterization measurements with the test measurements to determine at least one apparent killer defect on the at least one semiconductor die which passes the at least one test, and determining one or more gap areas on the one or more semiconductor devices for defect-based test coverage based on the at least one apparent killer defect on the at least one semiconductor die which passes the at least one test.