-
公开(公告)号：US11370180B2
公开(公告)日：2022-06-28
申请号：US17351746
申请日：2021-06-18
摘要： An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.
-
公开(公告)号：US11410914B2
公开(公告)日：2022-08-09
申请号：US16926008
申请日：2020-07-10
IPC分类号： H01L23/492 , H01L23/00 , H01L25/07 , H01L23/31
摘要： A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.
-
公开(公告)号：US12107023B2
公开(公告)日：2024-10-01
申请号：US17473196
申请日：2021-09-13
发明人： Keiichiro Matsuo , Izuru Komatsu , Haruka Yamamoto
IPC分类号： H01L23/053 , H01L23/00 , H01L23/15 , H01L23/31 , H01L23/492
CPC分类号： H01L23/053 , H01L23/15 , H01L23/3121 , H01L23/3135 , H01L23/492 , H01L24/48 , H01L2224/48091 , H01L2224/48177
摘要： A power module includes a base plate, a casing, a substrate unit, a terminal plate, a first resin layer, and a second resin layer. The substrate unit includes a substrate fixed on the base plate, a dam part, a semiconductor chip, a metal member, and a wire. The dam part is formed along an edge of the substrate. The wire includes an electrode plate connection portion, and a chip connection portion. The first resin layer is located inward of the dam part. The chip connection portion and the electrode plate connection portion are located inside the first resin layer. The second resin layer is located on the first resin layer. The upper surface of the metal member is located inside the second resin layer. An elastic modulus of the second resin layer is less than that of the first resin layer.
-
公开(公告)号：US11292211B1
公开(公告)日：2022-04-05
申请号：US17351774
申请日：2021-06-18
摘要： An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.
-
5.发明授权公开(公告)号：US10401172B2
公开(公告)日：2019-09-03
申请号：US15243511
申请日：2016-08-22
IPC分类号： G01C19/56 , B81B3/00 , G01C19/5762 , G01C19/5733
摘要： An angular velocity acquisition device includes a movable body, a drive electrode to which a drive voltage is applied to vibrate the movable body in a first direction, at least one stopper that stops the movable body at a predetermined position, a hold electrode which receives a hold voltage to hold the movable body at the predetermined position, a detection unit that detects a predetermined physical quantity depending on an amplitude of the vibration of the movable body in a second direction based on a Coriolis force acting on the movable body that vibrates in the first direction, and an angular velocity calculation unit that calculates an angular velocity of the movable body based on the predetermined physical quantity detected by the detection unit.
-
公开(公告)号：US10330472B2
公开(公告)日：2019-06-25
申请号：US15444272
申请日：2017-02-27
IPC分类号： G01C19/56 , G01C19/5712 , G01C19/5719 , G01C19/5755 , G01C19/5762 , G01P15/125
摘要： According to one embodiment, an angular velocity acquisition device includes a movable body that vibrates in a first direction and in a second direction that is based on Coriolis force and includes a movable electrode portion extending in the second direction, a hold electrode that extends in the second direction and includes a fixed electrode portion opposite to the movable electrode portion across a gap, and a stopper that is provided between the fixed electrode portion and the movable electrode portion and includes an end portion closer to the movable electrode portion than a surface of the fixed electrode portion facing the movable electrode portion.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.016 秒)
