Abstract:
According to one embodiment, an electronic device includes an underlying region, a variable capacitor including fixed electrodes and movable electrodes alternately arranged in a direction not perpendicular to a main surface of the underlying region, and a protective film which covers the variable capacitor and includes a conductive portion electrically connected to the fixed electrodes and having a hole.
Abstract:
A solid state imaging device according to an embodiment includes a photo detector arranged two-dimensionally in a semiconductor substrate, a readout circuit provided in the semiconductor substrate, a first photoelectric conversion layer provided above the photo detector, a plurality of first metal dots provided above the first photoelectric conversion layer, a second photoelectric conversion layer provided above the first metal dots, and a plurality of second metal dots provided above the second photoelectric conversion layer.
Abstract:
According to one embodiment, a sensor includes an element section including a first base and a first element. The first element includes a first fixed member fixed to the first base, a first connecting member supported by the first fixed member, and a first film portion supported by the first connecting member. A first gap is provided between the first base and the first film portion. The first film portion includes a first resistance layer, a first conductive layer, and a first conductive member provided between the first resistance layer and the first conductive layer. A potential of the first conductive member is fixed. A first electrical resistance of the first resistance layer is configured to change according to a state of a detection target around the first element.
Abstract:
According to one embodiment, a filter includes a first layer and a second layer. The first layer includes a first resin provided with a plurality of holes. The first layer includes a first face. At least a part of the plurality of holes reaches the first face. The second layer includes a second resin. The second resin blocks at least a part of the plurality of holes reaching the first face.
Abstract:
A partial discharge measurement system comprising: at least one sensor configured to detect a voltage signal propagating through a conductor connected to a rotating electrical machine in a non-contact manner; a first bandpass filter through which a component of a first frequency included in the voltage signal acquired by the sensor passes; a second bandpass filter through which a component of a second frequency included in the voltage signal acquired by the sensor passes, the second frequency being lower than the first frequency; a phase acquirer configured to acquire a phase waveform of the component of the second frequency having passed through the second bandpass filter; and an output interface configured to output information by which a component of partial discharge of the rotating electrical machine included in the component of the first frequency having passed through the first bandpass filter can be identified based on the phase waveform.
Abstract:
According to one embodiment, an insulation diagnostic system comprising: a peak-value acquisition circuit configured to acquire at least one peak value of a section corresponding to local discharge of a voltage signal acquired by at least one sensor that detects the voltage signal in a non-contact manner; a function acquisition circuit configured to acquire a calculation function for calculating charge amount related to the discharge based on at least two peak values acquired from the voltage signal that is detected by the sensor by applying a test voltage to a rotating electrical machine while the rotating electrical machine is stopped; and a charge-amount calculation circuit configured to calculate the charge amount related to partial discharge of the rotating electrical machine based on the calculation function and the peak value obtained from the voltage signal that is detected by the sensor during operation of the rotating electrical machine.
Abstract:
According to one embodiment, a semiconductor light emitting device includes a structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes an electrode layer provided on the second semiconductor layer side of the structure. The electrode layer includes a metal portion with a thickness of not less than 10 nanometers and not more than 100 nanometers. A plurality of openings pierces the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers. The device includes an inorganic film providing on the metal portion and inner surfaces of the openings, the inorganic film having transmittivity with respect to light emitted from the light emitting layer.
Abstract:
According to one embodiment, a sensor includes an element portion including a first base and a first element. The first element includes, a first fixed member fixed to the first base, a first resistance connecting member supported by the first fixed member, a first conductive connecting member supported by the first fixed member, and a first film portion supported by the first resistance connecting member and the first conductive connecting member. A first gap is provided between the first base and the first film portion. The first film portion includes a first resistance layer and a first conductive layer. The first resistance connecting member includes a first resistance wiring electrically connected to the first resistance layer. The first conductive connecting member includes a first conductive wiring electrically connected to the first conductive layer.
Abstract:
According to one embodiment, a sensor includes a housing, a sensor portion, and a film member. The housing includes a first housing member including an opening. The first housing member includes a first inner face, and a first side face inside the opening. The sensor portion includes a sensor member including a hole, and a sensor element. A first gap is provided between the sensor element and the sensor member. The film member is porous. The film member includes an inner region and an outer region around the inner region. The outer region faces the first inner face. The sensor member is located between the sensor element and the inner region. The sensor member faces the inner region. At least a part of the inner region overlaps the first side face in a second direction crossing a first direction from the sensor element to the sensor member.
Abstract:
The present disclosure provides a photoelectric conversion element comprising a photoelectric conversion layer laminated a first metal layer, a first semiconductor layer, a second semiconductor layer and a second metal layer. The first or second metal layer contains a porous metal thin film, and the porous metal thin film has plural openings penetrating through the film. Each of the openings has an area of 80 nm2 to 0.8 μm2 inclusive on average, and the porous metal thin film has a thickness of 2 nm to 200 nm inclusive. The second semiconductor layer has a smaller band gap than the first semiconductor layer, has polarity opposite to that of the first semiconductor layer, and is positioned within 5 nm from the porous metal thin film.