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公开(公告)号:US20240305376A1
公开(公告)日:2024-09-12
申请号:US18663749
申请日:2024-05-14
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes , Jeffery J. Maki , Chul Soo Park , Yang Yue , Jon J. Anderson
IPC: H04B10/2581 , G02B6/42 , H01S5/40 , H04B10/40 , H04B10/50 , H04B10/516 , H04B10/60 , H04J14/04
CPC classification number: H04B10/2581 , G02B6/425 , H01S5/4062 , H04B10/40 , H04B10/503 , H04B10/5161 , H04B10/60 , H04J14/04
Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.
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公开(公告)号:US20220103261A1
公开(公告)日:2022-03-31
申请号:US17478095
申请日:2021-09-17
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes
Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.
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公开(公告)号:US10182002B1
公开(公告)日:2019-01-15
申请号:US15693066
申请日:2017-08-31
Applicant: Juniper Networks, Inc.
Inventor: Dai Song , Domenico Di Mola , Puneet Jain
IPC: H04B10/079 , H04L12/721 , H04Q11/00
Abstract: A device may cause an optical signal to be transmitted via a network path. The device may receive, from a network device, a link layer discover protocol (LLDP) message. The LLDP message may include signal characteristic information regarding the optical signal. The device may adjust transmission of the optical signal based on receiving the LLDP message. The device may cause an adjusted optical signal to be transmitted via the network path based on adjusting transmission of the optical signal.
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公开(公告)号:US20230291478A1
公开(公告)日:2023-09-14
申请号:US18197266
申请日:2023-05-15
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes
CPC classification number: H04B10/40 , H04L1/0041 , H04L1/0045 , H04L27/34
Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.
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公开(公告)号:US11159240B1
公开(公告)日:2021-10-26
申请号:US17038453
申请日:2020-09-30
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes
Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.
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公开(公告)号:US10547379B2
公开(公告)日:2020-01-28
申请号:US15978792
申请日:2018-05-14
Applicant: Juniper Networks, Inc.
Inventor: Massimiliano Salsi , Domenico Di Mola , Gert Grammel
IPC: H04J14/00 , H04B10/077
Abstract: A method may include causing a signal to be transmitted that includes a plurality of wavelengths. The signal may be transmitted via an optical fiber that is associated with a particular wavelength. The particular wavelength may be included in the plurality of wavelengths. The method may include filtering the signal, based on the particular wavelength, to generate a filtered signal. The filtered signal may include the particular wavelength. The method may include detecting the filtered signal in association with the optical fiber. The method may include determining the particular wavelength based on the filtered signal. The method may include storing or providing information identifying at least one of the particular wavelength, the optical fiber, or a transmitter that transmitted the signal.
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公开(公告)号:US09973836B1
公开(公告)日:2018-05-15
申请号:US15067806
申请日:2016-03-11
Applicant: Juniper Networks, Inc.
Inventor: Massimiliano Salsi , Domenico Di Mola , Gert Grammel
CPC classification number: H04Q11/0071 , H04Q2011/0009 , H04Q2011/0032
Abstract: A method may include causing a signal to be transmitted that includes a plurality of wavelengths. The signal may be transmitted via an optical fiber that is associated with a particular wavelength. The particular wavelength may be included in the plurality of wavelengths. The method may include filtering the signal, based on the particular wavelength, to generate a filtered signal. The filtered signal may include the particular wavelength. The method may include detecting the filtered signal in association with the optical fiber. The method may include determining the particular wavelength based on the filtered signal. The method may include storing or providing information identifying at least one of the particular wavelength, the optical fiber, or a transmitter that transmitted the signal.
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公开(公告)号:US09755956B1
公开(公告)日:2017-09-05
申请号:US14942017
申请日:2015-11-16
Applicant: Juniper Networks, Inc.
Inventor: Dai Song , Domenico Di Mola , Puneet Jain
IPC: H04B10/08 , H04L12/721 , H04Q11/00 , H04B10/079
CPC classification number: H04L45/26 , H04B10/0793 , H04L45/02 , H04L45/62 , H04Q11/0066 , H04Q2011/0073 , H04Q2011/009 , Y02D30/30
Abstract: A device may cause an optical signal to be transmitted via a network path. The device may receive, from a network device, a link layer discover protocol (LLDP) message. The LLDP message may include signal characteristic information regarding the optical signal. The device may adjust transmission of the optical signal based on receiving the LLDP message. The device may cause an adjusted optical signal to be transmitted via the network path based on adjusting transmission of the optical signal.
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公开(公告)号:US20230254042A1
公开(公告)日:2023-08-10
申请号:US18130763
申请日:2023-04-04
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes , Jeffrey J. Maki , Chul Soo Park , Yang Yue , Jon J. Anderson
IPC: H04B10/2581 , G02B6/42 , H01S5/40 , H04B10/40 , H04B10/50 , H04B10/516 , H04B10/60
CPC classification number: H04B10/2581 , G02B6/425 , H01S5/4062 , H04B10/40 , H04B10/503 , H04B10/5161 , H04B10/60 , H04J14/04
Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.
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公开(公告)号:US11689289B2
公开(公告)日:2023-06-27
申请号:US17478095
申请日:2021-09-17
Applicant: Juniper Networks, Inc.
Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes
CPC classification number: H04B10/40 , H04L1/0041 , H04L1/0045 , H04L27/34
Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.
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