摘要:
A high deflection capping system has an elastomeric sealing member with a sealing lip that, when viewed in cross section, forms a smiling-shaped seal against an inkjet printhead to provide improved printhead sealing, particularly when sealing over surface irregularities on the printhead. This high deflection sealing member may be onsert molded onto a support frame. A series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads, with the flexible frame having a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead. Alternatively, the support frame may be designed to support only a single high deflection sealing member. A venting system is also provided with vapor diffusion handling capabilities.
摘要:
A flexible frame onsert molded capping system has an elastomeric sealing lip onsert molded onto a flexible, flat, springy support frame, preferably with series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads. The frame has a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead, even when the orifice plates of adjacent printheads are not in a coplanar alignment. Use of a single piece frame, and onsert molding of the cap lips thereon, decreases the number of parts required to assemble an inkjet printing mechanism, leading to a more economical unit which is easier to assemble.
摘要:
A flexible frame onsert molded capping system has an elastomeric sealing lip onsert molded onto a flexible, flat, springy support frame, preferably with series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads. The frame has a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead, even when the orifice plates of adjacent printheads are not in a coplanar alignment. Use of a single piece frame, and onsert molding of the cap lips thereon, decreases the number of parts required to assemble an inkjet printing mechanism, leading to a more economical unit which is easier to assemble.
摘要:
A flexible frame onsert molded capping system has an elastomeric sealing lip onsert molded onto a flexible, flat, springy support frame, preferably with series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads. The frame has a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead, even when the orifice plates of adjacent printheads are not in a coplanar alignment. Use of a single piece frame, and onsert molding of the cap lips thereon, decreases the number of parts required to assemble an inkjet printing mechanism, leading to a more economical unit which is easier to assemble.
摘要:
A high deflection capping system has an elastomeric sealing member with a sealing lip that, when viewed in cross section, forms a smiling-shaped seal against an inkjet printhead to provide improved printhead sealing, particularly when sealing over surface irregularities on the printhead. This high deflection sealing member may be onsert molded onto a support frame. A series of these sealing lips being molded on a single flexible frame to simultaneously seal several adjacent inkjet printheads, with the flexible frame having a border region with one or more cap bases attached to the frame by plural suspension spring elements. The suspension spring elements have both cantilever and torsional characteristics which allow the bases to tilt and twist independent of one another to seal each printhead. Alternatively, the support frame may be designed to support only a single high deflection sealing member. A venting system is also provided with vapor diffusion handling capabilities.
摘要:
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
摘要:
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.
摘要:
A method of operating an arc discharge lamp that has first and second electrodes is described. First, the first electrode is heated with a third electrode with a first arc until the first electrode temperature is sufficiently elevated to allow for thermionic emission. Then, a first voltage is applied between the first and second electrode at a voltage less than 1000 volts to create a second arc.
摘要:
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
摘要:
A wet-wiping printhead cleaning system including a treatment fluid applicator placing treatment fluid on at least one of two elements involved in wiping, said two elements being a printhead orifice plate surface and a wiper, the system being so configured that treatment fluid is applied before wiping the printhead by projecting treatment fluid onto at least one element through the atmosphere, thereby avoiding direct contact between the applicator and said one element, the treatment fluid being placed so as to be available to assist in wiping a portion of the printhead orifice plate where the nozzle orifices are located to remove debris that may have accumulated, the treatment fluid lubricating the wiper so as to lengthen wiper service life and enhance wiping performance, as well as acting to render such accumulations more removable by wiping, the source of treatment fluid being uncontaminated by contact with either the printhead or the wiper.