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    Light emitting die (LED) packages and related methods
    2.
    发明授权
    Light emitting die (LED) packages and related methods 有权

    公开(公告)号：US10256385B2

    公开(公告)日：2019-04-09

    申请号：US13187232

    申请日：2011-07-20

    申请人： Jeffrey Carl Britt ,  Yankun Fu

    发明人： Jeffrey Carl Britt ,  Brandon Stanton ,  Yankun Fu

    IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/54 ,  H01L23/00

    摘要： LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.

    Semiconductor light emitting device mounting substrates including a conductive lead extending therein
    5.
    发明授权
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein 有权
    半导体发光器件的安装基板包括在其中延伸的导电引线

    公开(公告)号：US07777247B2

    公开(公告)日：2010-08-17

    申请号：US11035716

    申请日：2005-01-14

    申请人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    发明人： Ban P. Loh ,  Gerald H. Negley ,  Yankun Fu

    IPC分类号： H01L29/24 ,  H01L23/34

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
    10.
    发明申请
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same 有权
    包括延伸在其中的导电引线的半导体发光器件安装基板及其封装方法

    公开(公告)号：US20060157726A1

    公开(公告)日：2006-07-20

    申请号：US11035716

    申请日：2005-01-14

    申请人： Ban Loh ,  Gerald Negley ,  Yankun Fu

    发明人： Ban Loh ,  Gerald Negley ,  Yankun Fu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。