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    Light emitting die (LED) packages and related methods
    2.
    发明授权
    Light emitting die (LED) packages and related methods 有权

    公开(公告)号：US10256385B2

    公开(公告)日：2019-04-09

    申请号：US13187232

    申请日：2011-07-20

    申请人： Jeffrey Carl Britt ,  Yankun Fu

    发明人： Jeffrey Carl Britt ,  Brandon Stanton ,  Yankun Fu

    IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/54 ,  H01L23/00

    摘要： LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.

    LIGHT EMITTING DEVICES INCLUDING MULTIPLE ANODES AND CATHODES
    3.
    发明申请
    LIGHT EMITTING DEVICES INCLUDING MULTIPLE ANODES AND CATHODES 有权
    发光装置，包括多个阳极和阴极

    公开(公告)号：US20130301257A1

    公开(公告)日：2013-11-14

    申请号：US13471164

    申请日：2012-05-14

    申请人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    发明人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    IPC分类号： F21V9/00 ,  F21V5/04 ,  F21V21/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Solid state (e.g., LED) lighting devices include multiple emitters mounted on or over a substrate comprising insulating material with conductive traces thereon, with various emitters being independently controllable with multiple pairs of anodes and cathodes that may be arranged on an opposite surface of the substrate than the emitters. Electrically conductive vias may be defined through the insulating substrate, and a molded lens may be provided over the substrate and emitters mounted thereon. Various combinations of independently controllable emitters or emitter groups may be provided, for example, a red emitter in combination with multiple blue shifted yellow (BSY) emitters, or separately controllable red, green, blue, and white (e.g., BSY) emitters.

    摘要翻译： 固态（例如，LED）照明装置包括安装在基板上或上方的多个发射器，其包括其上具有导电迹线的绝缘材料，其中各种发射器可独立地由多对阳极和阴极控制，所述多对阳极和阴极可布置在衬底的相对表面上 比排放者。 可以通过绝缘基板限定导电通孔，并且可以在基板上设置模制透镜并且安装在其上的发射器。 可以提供可独立控制的发射器或发射极组的各种组合，例如，与多个蓝色偏移的黄色（BSY）发射器或单独可控的红色，绿色，蓝色和白色（例如BSY）发射器组合的红色发射器。

    Light emitting devices including multiple anodes and cathodes
    6.
    发明授权
    Light emitting devices including multiple anodes and cathodes 有权
    包括多个阳极和阴极的发光器件

    公开(公告)号：US09515055B2

    公开(公告)日：2016-12-06

    申请号：US13471164

    申请日：2012-05-14

    申请人： Jeffrey Carl Britt ,  Michael P. Laughner

    发明人： Jeffrey Carl Britt ,  Michael P. Laughner ,  Brandon Stanton

    IPC分类号： F21V9/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Solid state (e.g., LED) lighting devices include multiple emitters mounted on or over a substrate comprising insulating material with conductive traces thereon, with various emitters being independently controllable with multiple pairs of anodes and cathodes that may be arranged on an opposite surface of the substrate than the emitters. Electrically conductive vias may be defined through the insulating substrate, and a molded lens may be provided over the substrate and emitters mounted thereon. Various combinations of independently controllable emitters or emitter groups may be provided, for example, a red emitter in combination with multiple blue shifted yellow (BSY) emitters, or separately controllable red, green, blue, and white (e.g., BSY) emitters.

    摘要翻译： 固态（例如，LED）照明装置包括安装在基板上或上方的多个发射器，其包括其上具有导电迹线的绝缘材料，其中各种发射器可独立地由多对阳极和阴极控制，所述多对阳极和阴极可布置在衬底的相对表面上 比排放者。 可以通过绝缘基板限定导电通孔，并且可以在基板上设置模制透镜并且安装在其上的发射器。 可以提供可独立控制的发射器或发射极组的各种组合，例如，与多个蓝色偏移的黄色（BSY）发射器或单独可控的红色，绿色，蓝色和白色（例如BSY）发射器组合的红色发射器。

    Emission tuning methods and devices fabricated utilizing methods
    7.
    发明授权
    Emission tuning methods and devices fabricated utilizing methods 有权
    使用方法制造的排放调节方法和装置

    公开(公告)号：US08877524B2

    公开(公告)日：2014-11-04

    申请号：US12414457

    申请日：2009-03-30

    申请人： Ashay Chitnis ,  John Edmond ,  Jeffrey Carl Britt ,  Bernd P. Keller ,  David Todd Emerson ,  Michael John Bergmann ,  Jasper S. Cabalu

    发明人： Ashay Chitnis ,  John Edmond ,  Jeffrey Carl Britt ,  Bernd P. Keller ,  David Todd Emerson ,  Michael John Bergmann ,  Jasper S. Cabalu

    IPC分类号： H01L21/66 ,  H01L33/00 ,  H01L33/50

    CPC分类号： H01L33/508 ,  H01L33/0095 ,  H01L2224/13 ,  H01L2933/0041 ,  Y10T408/47

    摘要： A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.

    摘要翻译： 一种用于制造发光二极管（LED）芯片的方法，包括通常在晶片上提供多个LED，并用转换材料涂覆LED，使得来自LED的至少一些光通过转换材料并被转换。 来自LED芯片的光发射包括来自转换材料的光，通常与LED光结合。 测量至少一些LED芯片的发射特性，并且除去LED上的至少一些转换材料以改变LED芯片的发射特性。 本发明特别适用于在晶片上制造LED芯片，其中LED芯片具有在目标发射特性范围内的发光特性。 该目标范围可以落在CIE曲线上的发射区域内，以减少对来自晶片的LED进行合并的需要。 晶片上的LED芯片的发射特性可以通过在LED上微转换材料来调节到期望的范围。