公开(公告)号：US20080054286A1

公开(公告)日：2008-03-06

申请号：US11895795

申请日：2007-08-27

申请人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

发明人： Ban Loh ,  Peter Andrews ,  Nicholas Medendorp

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2924/00014

摘要： Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.

摘要翻译： 公开了发光器件封装，发光二极管（LED）封装和相关方法。 根据一个方面，提供一种发光器件封装。 该包装包括适于附接发光装置的安装垫。 透镜耦合器附接到安装焊盘并且限定用于容纳发光器件的开口和一定数量的密封剂。 透镜耦合器包括限定凹陷的表面，其包括形成密封剂的外表面的至少一个边缘。

公开(公告)号：US20070274667A1

公开(公告)日：2007-11-29

申请号：US11431304

申请日：2006-05-10

申请人： Ban Loh ,  Nicholas Medendorp

发明人： Ban Loh ,  Nicholas Medendorp

IPC分类号： G02B6/10

CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Sideways emission enhancements are described for light emitting diode (LED) lighting solutions having a wide variety of applications. While a typical LED lighting device has a substantial portion of its light emitted near a normal to the semiconductor photonic chip emitting the light, the present approach may suitable provide a compact, easily manufacturable device with good thermal design characteristics and a changed emission pattern without changing the horizontal mounting plane of the semiconductor photonic chip.

摘要翻译： 针对具有各种应用的发光二极管（LED）照明解决方案描述了侧向发射增强。 虽然典型的LED照明装置的光的大部分发射在发射光的半导体光子芯片的正常附近，但是本方法可以适合提供具有良好的热设计特性和改变的发射图案的紧凑的，易于制造的装置，而不改变 半导体光子芯片的水平安装平面。

公开(公告)号：US20070253209A1

公开(公告)日：2007-11-01

申请号：US11412381

申请日：2006-04-27

申请人： Ban Loh ,  Nicholas Medendorp ,  Bernd Keller

发明人： Ban Loh ,  Nicholas Medendorp ,  Bernd Keller

IPC分类号： B60Q1/124

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

公开(公告)号：US20070200127A1

公开(公告)日：2007-08-30

申请号：US11689868

申请日：2007-03-22

申请人： Peter Andrews ,  Ban Loh

发明人： Peter Andrews ,  Ban Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

摘要翻译： 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

公开(公告)号：US20070181901A1

公开(公告)日：2007-08-09

申请号：US11694046

申请日：2007-03-30

申请人： Ban Loh

发明人： Ban Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.

摘要翻译： 提供了一种发光管芯（LED）封装，其包括具有迹线的衬底，安装在衬底上并连接到迹线上的LED以及覆盖LED的密封剂。 该包装包括位于密封剂上并基本上覆盖LED的透镜。 透镜相对于基板自由移动。

公开(公告)号：US20070138497A1

公开(公告)日：2007-06-21

申请号：US11703721

申请日：2007-02-08

申请人： Ban Loh

发明人： Ban Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

公开(公告)号：US20060157726A1

公开(公告)日：2006-07-20

申请号：US11035716

申请日：2005-01-14

申请人： Ban Loh ,  Gerald Negley ,  Yankun Fu

发明人： Ban Loh ,  Gerald Negley ,  Yankun Fu

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

公开(公告)号：US20050051782A1

公开(公告)日：2005-03-10

申请号：US10659240

申请日：2003-09-09

申请人： Gerald Negley ,  Ban Loh

发明人： Gerald Negley ,  Ban Loh

IPC分类号： B29C39/00 ,  B29C45/00 ,  H01H13/83 ,  H01L33/50 ,  H01L33/58 ,  H01L27/15

CPC分类号： B29D11/0074 ,  B29C39/003 ,  B29C45/0001 ,  B29K2995/0018 ,  B29L2011/00 ,  B29L2031/3431 ,  H01H13/83 ,  H01H2219/014 ,  H01H2219/052 ,  H01H2221/07 ,  H01H2229/046 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A transmissive optical element is fabricated by filling a mold with molten liquid that includes a transparent plastic and a phosphor additive, and allowing the molten liquid to solidify to produce the transmissive optical element having phosphor dispersed therein. Accordingly, a separate phosphor coating or phosphor-containing encapsulant need not be used. Transmissive optical elements include a shell made of transparent plastic with a phosphor dispersed therein. The phosphor may be uniformly and/or nonuniformly dispersed in the shell.

摘要翻译： 通过用包含透明塑料和荧光体添加剂的熔融液体填充模具来制造透射光学元件，并且允许熔融液体固化以产生其中分散有荧光体的透射光学元件。 因此，不需要使用单独的荧光体涂层或含磷光体的密封剂。 透射光学元件包括由透明塑料制成的壳体，其中分散有磷光体。 荧光体可以均匀地和/或不均匀地分散在壳中。

公开(公告)号：US20070161135A1

公开(公告)日：2007-07-12

申请号：US11328887

申请日：2006-01-09

申请人： Bernd Keller ,  Ban Loh

发明人： Bernd Keller ,  Ban Loh

IPC分类号： H01L21/00

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。

公开(公告)号：US20060279962A1

公开(公告)日：2006-12-14

申请号：US11153724

申请日：2005-06-14

申请人： Ban Loh

发明人： Ban Loh

IPC分类号： F21V13/00 ,  F21V7/04

CPC分类号： G02F1/133603 ,  G02F1/133606 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A display system including a display panel having a first major surface and a second major surface and a lighting system adapted to provide uniform luminance proximal to the display panel is disclosed. The lighting system includes an illuminating substrate having a first major surface with reflective coating and a second major surface. The illuminating substrate defines an array of mounting holes, each hole occupied by an LED module. An array of light emitting diode (LED) modules are affixed to the illuminating substrate, each module including at least one light emitting diode adapted to emit light. The lighting system can also include a diffusant layer which can be optically coupled to the illuminating substrate by soft optical gel and is placed close to or made to contact the display panel. The optical gel may contain phosphors or other optical substance for added optical performance to the lighting system. The diffusant layer has beveled edges at critical angle of refraction or coated with reflective material to minimize light loss at its edges. Each of the LED modules includes at least one LED chip, conductive traces connected to the LED chip and a heat sink.

摘要翻译： 公开了一种显示系统，包括具有第一主表面和第二主表面的显示面板和适于在显示面板附近提供均匀亮度的照明系统。 照明系统包括具有带有反射涂层的第一主表面和第二主表面的照明基板。 照明基板限定一组安装孔，每个孔由LED模块占据。 一组发光二极管（LED）模块固定到照明基板上，每个模块包括适于发光的至少一个发光二极管。 照明系统还可以包括扩散层，其可以通过柔性光学凝胶光学耦合到照明基底并且靠近显示面板或与显示面板接触。 光学凝胶可以含有荧光体或其它用于向照明系统增加光学性能的光学物质。 扩散层在临界折射角处具有倾斜边缘，或涂覆有反射材料，以最小化其边缘处的光损失。 每个LED模块包括至少一个LED芯片，连接到LED芯片的导电迹线和散热器。