公开(公告)号：US09024349B2

公开(公告)日：2015-05-05

申请号：US11656759

申请日：2007-01-22

申请人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/38 ,  H01L33/62 ,  H01L33/44 ,  H01L33/50 ,  H01L23/31

CPC分类号： H01L33/62 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/501 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

公开(公告)号：US20080179611A1

公开(公告)日：2008-07-31

申请号：US11899790

申请日：2007-09-07

申请人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  James Seruto ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/00

CPC分类号： H01L33/508 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/387 ,  H01L33/44 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

摘要翻译： 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层埋入至少一些基座。 然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过引线接合露出的基座。 本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

公开(公告)号：US20080173884A1

公开(公告)日：2008-07-24

申请号：US11656759

申请日：2007-01-22

申请人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Arpan Chakraborty ,  Eric J. Tarsa ,  Bernd Keller ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/387 ,  H01L33/44 ,  H01L33/501 ,  H01L33/507 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.