摘要:
Disclosed is a portable terminal, including, a first conductor formed on one surface of a board and having a contact surface, a second conductor formed at an outer periphery of the first conductor and having a support surface, and a metal dome supported by the support surface and transformed responsive to a key being pressed so as to contact the contact surface, wherein the contact surface is located at a position lower than the support surface so as to increase a transformation stroke of the metal dome.
摘要:
A light emitting diode (“LED”) backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards (“LED-PCBs”) on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.
摘要:
A semiconductor device capable of reducing a thickness, an electronic product employing the same, and a method of fabricating the same are provided. The method of fabricating a semiconductor device includes preparing a semiconductor substrate having first and second active regions. A first transistor in the first active region includes a first gate pattern and first impurity regions. A second transistor the second active region includes a second gate pattern and second impurity regions. A first conductive pattern is on the first transistor, wherein at least a part of the first conductive pattern is disposed at a same distance from an upper surface of the semiconductor substrate as at least a part of the second gate pattern. The first conductive pattern may be formed on the first transistor while the second transistor is formed.
摘要:
A backlight assembly includes a lamp socket unit, a printed circuit board and a lower receiving container. The printed circuit board includes a cutout portion which receives the lamp socket unit therethrough. The lower receiving container receives the lamp socket unit and the printed circuit board. The lamp socket unit is coupled to the printed circuit board, and the printed circuit board, having the lamp socket unit coupled thereto, is disposed in the lower receiving container.
摘要:
In a photoresist composition suitable for forming a photoresist pattern having a high profile angle, and a method of forming a photoresist pattern using the same, the photoresist composition includes an alkali-soluble resin, a quinone diazide containing compound, a compound represented by Formula 1, and a solvent: wherein R1, R2 and R3 are independently H, C1-4 alkyl, C2-4 alkenyl, C3-8 cycloalkyl, or C6-12 aryl.
摘要:
A supporting member for a liquid crystal display device comprises a base substrate, a lamp clip protruded from the base substrate in a first direction to hold a lamp that generates light, a supporting part protruded from the base substrate in the first direction to support a diffusion member that diffuses the light generated from the lamp, and a fixing clip protruded from the base substrate in a second direction substantially opposite to the first direction, wherein the fixing clip combines with a receiving container.
摘要:
A semiconductor memory device includes unit active regions, word lines extending in a first direction over the unit active region, bit lines extending on the word lines in a second direction substantially perpendicularly to the first direction, first pad contacts in contact with central portions of the unit active regions, the first pad contacts being arranged between the word lines, direct contacts electrically connected between the first pad contacts and the bit lines, second pad contacts in contact with edge portions of the unit active regions, the second pad contacts being arranged between the word lines and between the bit lines, buried contacts electrically connected to the second pad contacts, and capacitors electrically connected to the buried contacts.
摘要:
A semiconductor integrated circuit includes a semiconductor substrate, a plurality of trenches formed to extend in one direction in the semiconductor substrate, at least one connecting trench connecting at least two of the plurality of trenches to each other, a plurality of trench transistors including a plurality of gate electrodes, each gate electrode partially filling a corresponding trench, and a capping layer filling the at least one connecting trench.
摘要:
In a backlight assembly and a flat panel display apparatus, the backlight assembly has a diffusing plate, a supporting member and a reflecting plate. The supporting member has a base body portion, a supporting portion supporting the diffusing plate and a lamp holder receiving lamps to uniformly maintain spaced intervals between the lamps. The base body portion is disposed under the reflecting plate. The supporting portion and the lamp holder are inserted through engaging openings formed at the reflecting plate such that the supporting portion and the lamp holder are upwardly protruded with respect to the reflecting plate. Accordingly, the backlight assembly may reduce an area of the reflecting plate covered by the supporting member, thereby providing the light having uniform brightness distribution.
摘要:
A light source assembly includes a heat interception portion disposed between a light source unit and an optical member. The heat interception portion may be extended from the light source unit. Alternatively, the heat interception portion may be extended from a receiving container that receives the light source unit and the optical member. The heat transferred from the light source unit to the optical member may be reduced. Thus, deformation of the optical member may be prevented and the display quality of the image from the liquid crystal display apparatus using the light source assembly may be improved.