Fail-safe thermal sensor apparatus and method
    1.
    发明授权
    Fail-safe thermal sensor apparatus and method 失效
    故障安全热传感器装置及方法

    公开(公告)号:US07228508B1

    公开(公告)日:2007-06-05

    申请号:US09707386

    申请日:2000-11-07

    Applicant: Jack D. Pippin

    Inventor: Jack D. Pippin

    Abstract: A fail-safe thermal sensor is implemented in an integrated circuit such as a microprocessor. The fail-safe thermal sensor monitors the temperature of the integrated circuit and halt logic halts operation of the integrated circuit in response to the fail-safe thermal sensor indicating that a threshold temperature has been exceeded. The threshold temperature may be a predetermined fixed critical temperature. The halt logic may inhibit operation of the integrated circuit by stopping a clock for the integrated circuit.

    Abstract translation: 在诸如微处理器的集成电路中实现故障安全的热传感器。 故障安全热传感器监测集成电路的温度,并且响应于指示已经超过阈值温度的故障安全热传感器停止逻辑停止集成电路的操作。 阈值温度可以是预定的固定临界温度。 停止逻辑可以通过停止集成电路的时钟来禁止集成电路的操作。

    INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING
    2.
    发明申请
    INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING 有权
    用于调节流量测试工具的插件

    公开(公告)号:US20140029150A1

    公开(公告)日:2014-01-30

    申请号:US13976970

    申请日:2012-03-06

    CPC classification number: H02H9/02 G01R1/07385 G01R1/36 G01R31/2889

    Abstract: An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.

    Abstract translation: 描述了内插器来调节晶圆测试工具中的电流。 在一个示例中,插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。 插入器还包括过电流限制电路,用于连接第一和第二连接焊盘,并且当第一和第二连接焊盘之间的电流超过预定量时,断开第一和第二连接焊盘。

    Method and apparatus for programmable thermal sensor for an integrated circuit
    3.
    发明授权
    Method and apparatus for programmable thermal sensor for an integrated circuit 失效
    用于集成电路的可编程热传感器的方法和装置

    公开(公告)号:US07216064B1

    公开(公告)日:2007-05-08

    申请号:US08636024

    申请日:1996-04-19

    Applicant: Jack D. Pippin

    Inventor: Jack D. Pippin

    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a preprogrammed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.

    Abstract translation: 可编程热传感器在诸如微处理器的集成电路中实现。 可编程热传感器监控集成电路的温度,并产生一个输出,以指示集成电路的温度达到预编程的阈值温度。 在微处理器实现中,微处理器包含处理器单元,内部寄存器,微程序和时钟电路。 微程序将对应于阈值温度的可编程输入值写入内部寄存器。 可编程热敏传感器读取可编程输入值,并在微处理器的温度达到阈值温度时产生中断。 除可编程热敏传感器外,微处理器还包含一个故障安全的热传感器,当温度达到临界温度时,该传感器会停止微处理器的运行。

    METHOD AND APPARATUS FOR PROGRAMMABLE THERMAL SENSOR FOR AN INTEGRATED CIRCUIT
    4.
    发明申请
    METHOD AND APPARATUS FOR PROGRAMMABLE THERMAL SENSOR FOR AN INTEGRATED CIRCUIT 审中-公开
    用于集成电路的可编程热传感器的方法和装置

    公开(公告)号:US20130173082A1

    公开(公告)日:2013-07-04

    申请号:US13786274

    申请日:2013-03-05

    Applicant: Jack D. Pippin

    Inventor: Jack D. Pippin

    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.

    Abstract translation: 可编程热传感器在诸如微处理器的集成电路中实现。 可编程热传感器监测集成电路的温度,并产生一个输出,以指示集成电路的温度达到预编程的阈值温度。 在微处理器实现中,微处理器包含处理器单元,内部寄存器,微程序和时钟电路。 微程序将对应于阈值温度的可编程输入值写入内部寄存器。 可编程热敏传感器读取可编程输入值,并在微处理器的温度达到阈值温度时产生中断。 除可编程热敏传感器外,微处理器还包含一个故障安全的热传感器,当温度达到临界温度时,该传感器会停止微处理器的运行。

    Methods and apparatus for thermal management of an integrated circuit die
    5.
    发明授权
    Methods and apparatus for thermal management of an integrated circuit die 有权
    集成电路管芯的热管理方法和装置

    公开(公告)号:US07158911B2

    公开(公告)日:2007-01-02

    申请号:US10821822

    申请日:2004-04-09

    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.

    Abstract translation: 集成的片上热管理系统,提供IC器件的闭环温度控制和执行IC器件热管理的方法。 热管理系统包括温度检测元件,功率调制元件,控制元件和可见度元件。 温度检测元件包括用于检测管芯温度的温度传感器。 功率调制元件可以通过直接降低IC器件的功耗来限制IC器件执行指令的速度,通过限制由IC器件执行的指令的数量,或通过 这些技术的组合。 控制元件允许控制热管理系统的行为,并且可见性元件允许外部设备监视热管理系统的状态。

    Temperature-based cooling device controller apparatus and method
    9.
    发明授权
    Temperature-based cooling device controller apparatus and method 失效
    基于温度的冷却装置控制装置及方法

    公开(公告)号:US06975047B2

    公开(公告)日:2005-12-13

    申请号:US10464284

    申请日:2003-06-18

    Applicant: Jack D. Pippin

    Inventor: Jack D. Pippin

    Abstract: A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.

    Abstract translation: 基于温度的冷却装置控制器在诸如微处理器的集成电路中实现。 基于温度的冷却装置控制器包括用于存储阈值温度值的寄存器,热传感器和时钟调整逻辑,以响应于表示已经超过阈值温度值的热传感器激活冷却装置。 在微处理器实现中,微处理器包含多个热传感器,每个热传感器分别放置在跨越集成电路的多个不同位置中的一个中,并且平均机构用于计算来自多个热传感器的平均温度。 阈值调整逻辑响应于热传感器指示阈值温度值已被超过,将阈值温度值增加到新的阈值温度值。 阈值调整逻辑进一步降低新的阈值温度以检测温度的降低。

    Temperature-based cooling device controller apparatus and method
    10.
    发明授权
    Temperature-based cooling device controller apparatus and method 失效
    基于温度的冷却装置控制装置及方法

    公开(公告)号:US06630754B1

    公开(公告)日:2003-10-07

    申请号:US09707860

    申请日:2000-11-07

    Applicant: Jack D. Pippin

    Inventor: Jack D. Pippin

    Abstract: A temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and cooling activation logic to activate an active cooling device in response to an interrupt signal. The thermal sensor includes a current source, a voltage reference coupled to the current source to provide a bandgap reference voltage, wherein the bandgap reference voltage is substantially constant over a range of temperatures, programmable circuitry providing an output voltage that varies with the integrated circuit temperature and in accordance with the register value, and a comparator, wherein the comparator generates an interrupt signal if a difference between the output voltage and the bandgap reference voltage indicates that the threshold temperature has been exceeded.

    Abstract translation: 基于温度的冷却装置控制器包括用于存储阈值温度值的寄存器,热传感器和冷却激活逻辑,以响应于中断信号来激活主动冷却装置。 热传感器包括电流源,耦合到电流源的电压基准以提供带隙参考电压,其中带隙参考电压在一定温度范围内基本恒定,可编程电路提供随集成电路温度变化的输出电压 并且根据寄存器值,以及比较器,其中如果输出电压和带隙参考电压之间的差指示已经超过阈值温度,则比较器产生中断信号。

Patent Agency Ranking