Invention Grant
- Patent Title: Fail-safe thermal sensor apparatus and method
- Patent Title (中): 故障安全热传感器装置及方法
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Application No.: US09707386Application Date: 2000-11-07
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Publication No.: US07228508B1Publication Date: 2007-06-05
- Inventor: Jack D. Pippin
- Applicant: Jack D. Pippin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H03K19/00

Abstract:
A fail-safe thermal sensor is implemented in an integrated circuit such as a microprocessor. The fail-safe thermal sensor monitors the temperature of the integrated circuit and halt logic halts operation of the integrated circuit in response to the fail-safe thermal sensor indicating that a threshold temperature has been exceeded. The threshold temperature may be a predetermined fixed critical temperature. The halt logic may inhibit operation of the integrated circuit by stopping a clock for the integrated circuit.
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