Invention Grant
- Patent Title: Interposer to regulate current for wafer test tooling
- Patent Title (中): 用于晶圆测试工具调节电流的插件
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Application No.: US13976970Application Date: 2012-03-06
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Publication No.: US09391447B2Publication Date: 2016-07-12
- Inventor: Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
- Applicant: Evan M. Fledell , Paul B. Fischer , Roy E. Swart , Timothy J. Maloney , Jack D. Pippin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2012/027919 WO 20120306
- International Announcement: WO2013/133809 WO 20130912
- Main IPC: H02H9/08
- IPC: H02H9/08 ; H02H9/02 ; G01R1/36 ; G01R31/28 ; G01R1/073

Abstract:
An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
Public/Granted literature
- US20140029150A1 INTERPOSER TO REGULATE CURRENT FOR WAFER TEST TOOLING Public/Granted day:2014-01-30
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