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公开(公告)号:US20180046081A1
公开(公告)日:2018-02-15
申请号:US15672660
申请日:2017-08-09
Applicant: JSR CORPORATION
Inventor: Masayuki MIYAKE , Goji WAKAMATSU , Tsubasa ABE , Kazunori TAKANASHI , Kazunori SAKAI
IPC: G03F7/09 , G03F7/004 , C08G8/20 , H01L21/027 , H01L21/033 , G03F7/11 , H01L21/02 , H01L21/768
Abstract: A resist underlayer film-forming composition includes a solvent, and a compound comprising an aromatic ring. The solvent includes a first solvent having a normal boiling point of less than 156° C., and a second solvent having a normal boiling point of no less than 156° C. and less than 300° C. The resist underlayer film-forming composition is for use in forming a resist underlayer film to be overlaid on a patterned substrate. A production method of a patterned substrate includes applying the resist underlayer film-forming composition on a patterned substrate to obtain a coating film on the patterned substrate. The coating film is heated to obtain a resist underlayer film. A resist pattern is formed on an upper face side of the resist underlayer film. The resist underlayer film and the substrate are etched using the resist pattern as a mask.
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公开(公告)号:US20250004375A1
公开(公告)日:2025-01-02
申请号:US18829747
申请日:2024-09-10
Applicant: JSR CORPORATION
Inventor: Ryuichi NEMOTO , Masayuki MIYAKE , Michihiro MITA , Yudai ABE , Kazuya KIRIYAMA
Abstract: A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
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公开(公告)号:US20240319597A1
公开(公告)日:2024-09-26
申请号:US18678331
申请日:2024-05-30
Applicant: JSR CORPORATION
Inventor: Ryuichi NEMOTO , Michihiro MITA , Masayuki MIYAKE
CPC classification number: G03F7/0397 , G03F7/0045 , G03F7/0382 , G03F7/322 , G03F7/325
Abstract: A radiation-sensitive resin composition includes: a compound A represented by formula (I); a resin B including a structural unit having an acid-dissociable group; a radiation-sensitive acid generator other than the compound A; and a solvent. R1 is an (m+m′)-valent organic group and comprises a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both; X1 is a group represented by formula (1-1) or a group represented by formula (1-2); X2 is a group represented by formula (2-1) or a group represented by formula (2-2); Y+ is a monovalent onium cation; m is an integer of 1 to 2, and m′ is an integer of 0 to 1. * represents a bond to another group.
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公开(公告)号:US20190094695A1
公开(公告)日:2019-03-28
申请号:US16205502
申请日:2018-11-30
Applicant: JSR CORPORATION
Inventor: Naoya NOSAKA , Gouji WAKAMATSU , Tsubasa ABE , Yuushi MATSUMURA , Masayuki MIYAKE , Yoshio TAKIMOTO
IPC: G03F7/11 , C09D165/00 , G03F7/26 , C07D405/14 , C07D311/74 , C07D311/92 , C08G61/10 , H01L21/027
Abstract: The composition for film formation includes a compound including a group of the formula (1) and a solvent. In the formula (1), R1 to R4 each independently represent a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, or R1 to R4 taken together represent a cyclic structure having 3 to 20 ring atoms together with the carbon atom or a carbon chain to which R1 to R4 bond. Ar1 represents a group obtained by removing (n+3) hydrogen atoms from an aromatic ring of an arene having 6 to 20 carbon atoms. n is an integer of 0 to 9. R5 represents a hydroxy group, a halogen atom, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms.
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