公开(公告)号：US20020146861A1

公开(公告)日：2002-10-10

申请号：US10106927

申请日：2002-03-26

Applicant: International rectifier corp.

Inventor： Martin Standing

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29078 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/13091 ,  H05K3/305 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A process for forming an insulation underfill for soldering semiconductor die solder balls by a solder paste on conductive traces on a support surface. The process comprises the screen printing or deposition from a syringe of thermoplastic or thermosetting epoxy columns between the solder balls, to a height equal to the standoff height of the die from the support surface. The assembly is first heated to a temperature at which the plastic becomes semifluid and before the area over which it will spread becomes contaminated with flux residue; and is next heated to the solder paste reflow temperature.

Abstract translation: 用于通过焊膏在支撑表面上的导电迹线上形成用于焊接半导体焊料球的绝缘底部填充物的方法。 该方法包括从焊球之间的热塑性或热固性环氧树脂柱的注射器的丝网印刷或沉积到与模具从支撑表面的间隔高度相等的高度。 首先将组件加热到塑料变成半流体的温度，并且在其将被扩散的区域被熔剂残渣污染之前; 并接着加热到焊膏回流温度。

公开(公告)号：US20010048116A1

公开(公告)日：2001-12-06

申请号：US09819774

申请日：2001-03-28

Applicant: International Rectifier Corp.

Inventor： Martin Standing ,  Hazel D. Schofield

IPC: H01L029/74 ,  H01L021/44

CPC classification number: H01L23/492 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/1147 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.

Abstract translation: 芯片级封装具有半导体MOSFET管芯，其具有覆盖有感光性液体环氧树脂层的顶部电极表面，该层被光刻图案化以暴露电极表面的部分并且用作钝化层和作为焊接掩模。 然后在钝化层上形成可焊接接触层。 单个管芯的排水侧面向下安装在金属夹子或罐中，其中漏电极设置为与罐底部延伸的凸缘共面。