LOCALIZED COMPUTER SYSTEM HUMIDITY CONTROL
    1.
    发明申请
    LOCALIZED COMPUTER SYSTEM HUMIDITY CONTROL 有权
    本地化计算机系统湿度控制

    公开(公告)号:US20160313747A1

    公开(公告)日:2016-10-27

    申请号:US14697292

    申请日:2015-04-27

    Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

    Abstract translation: 一种用于计算机系统的空气湿度控制系统包括具有空气通道的壳体和具有吸附材料的空气湿度控制元件,该空气湿度控制元件暴露在空气通道中,以便能够朝向和来自空气湿度控制元件的流体连通。 该元件被设计成使得吸附材料在操作中适应于从具有第一温度和第一相对湿度的流入空气通道的第一气流中吸收水分,并将水分解吸到第二空气流,所述空气 具有比第一温度高至少5℃的第二温度和比第一相对湿度低至少3%的第二湿度的流。

    DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

    公开(公告)号:US20200072562A1

    公开(公告)日:2020-03-05

    申请号:US16665046

    申请日:2019-10-28

    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

    公开(公告)号:US20200011617A1

    公开(公告)日:2020-01-09

    申请号:US16030097

    申请日:2018-07-09

    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    SEALING ARRANGEMENT
    4.
    发明申请
    SEALING ARRANGEMENT 审中-公开
    密封安排

    公开(公告)号:US20160061365A1

    公开(公告)日:2016-03-03

    申请号:US14830310

    申请日:2015-08-19

    Abstract: An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

    Abstract translation: 本发明的实施例可以包括密封装置。 密封装置可以包括具有主体的第一部件,其中主体具有外表面和从外表面突出的第一臂。 第一臂包括面向身体的外表面的内表面。 密封装置可以包括由第一部件的第一臂接合的第二部件。 第二部件可以具有布置在第一臂的内表面和主体的外表面之间的空间内的第一部分和布置在该空间外侧并且邻近第一臂的外表面的第二部分。

    Sealing arrangement
    5.
    发明授权

    公开(公告)号:US10763189B2

    公开(公告)日:2020-09-01

    申请号:US14830310

    申请日:2015-08-19

    Abstract: An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

    Disconnect assembly for active cooling of packaged electronics

    公开(公告)号:US10527365B1

    公开(公告)日:2020-01-07

    申请号:US16030097

    申请日:2018-07-09

    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    Disconnect assembly for active cooling of packaged electronics

    公开(公告)号:US10767939B2

    公开(公告)日:2020-09-08

    申请号:US16665046

    申请日:2019-10-28

    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    Localized computer system humidity control

    公开(公告)号:US10095249B2

    公开(公告)日:2018-10-09

    申请号:US14984420

    申请日:2015-12-30

    Abstract: An air moisture control system for a computer system includes a housing with an air passage and an air moisture control element with an adsorption material, which is exposed in the air passage so as to enable fluid communication towards and from the air moisture control element. The element is designed such that the adsorption material is adapted, in operation, to adsorb moisture from a first air flow flowing into the air passage, having a first temperature and a first relative humidity, and desorb moisture to a second air flow, said air flow having a second temperature at least 5° C. higher than the first temperature and a second humidity at least 3% lower than the first relative humidity.

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