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Patent Agency Ranking
公开(公告)号：US20210103317A1
公开(公告)日：2021-04-08
申请号：US17100849
申请日：2020-11-21
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Samarth Alva , Bhavaneeswaran Anbalagan , Triplicane Gopikrishnan Babu , Prasanna Pichumani , Raghavendra Doddi , Sudheera Sudhakar , Ritu Bawa
Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
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公开(公告)号：US12230866B2
公开(公告)日：2025-02-18
申请号：US17129698
申请日：2020-12-21
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Maruti Tamrakar , Sagar Gupta , Prasanna Pichumani , Sudheera Sudhakar
IPC: H01Q1/24 , H04B1/3827 , H04B1/401 , H04W52/36
Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
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公开(公告)号：US12117876B2
公开(公告)日：2024-10-15
申请号：US17100849
申请日：2020-11-21
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Samarth Alva , Bhavaneeswaran Anbalagan , Triplicane Gopikrishnan Babu , Prasanna Pichumani , Raghavendra Doddi , Sudheera Sudhakar , Ritu Bawa
CPC classification number: G06F1/1681 , G06F1/1618 , G06F1/203 , G06F2200/203
Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
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公开(公告)号：US20240210988A1
公开(公告)日：2024-06-27
申请号：US18129524
申请日：2023-03-31
Applicant: Intel Corporation
Inventor： David Pidwerbecki , Arvind S , Jeff Ku , Juha Tapani Paavola , Prakash Kurma Raju , Amruta Krishnakumar Ranade , Sudheera Sudhakar , Mousumi Deka , Snehal Chaudhari , Akarsha R. Kadadevaramath
CPC classification number: G06F1/1615 , B32B5/02 , B32B5/26 , C23C14/205 , C23C14/35 , C23C16/06 , B32B2255/02 , B32B2255/205 , B32B2255/28 , B32B2260/023 , B32B2260/046 , B32B2457/00
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
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公开(公告)号：US20210111481A1
公开(公告)日：2021-04-15
申请号：US17129698
申请日：2020-12-21
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Maruti Tamrakar , Sagar Gupta , Prasanna Pichumani , Sudheera Sudhakar
IPC: H01Q1/24 , H04B1/3827 , H04B1/401 , H04W52/36
Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
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