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公开(公告)号：US20240324144A1
公开(公告)日：2024-09-26
申请号：US18189428
申请日：2023-03-24
Applicant: Intel Corporation
Inventor： Juha Tapani Paavola , Christopher Moore , Jeff Ku , Prakash Kurma Raju
CPC classification number: H05K7/20336 , G06F1/203 , H05K7/20154
Abstract: Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.
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公开(公告)号：US20240155790A1
公开(公告)日：2024-05-09
申请号：US18544694
申请日：2023-12-19
Applicant: Intel Corporation
Inventor： Deepak Sekar , Samarth Alva , Prakash Kurma Raju , Prasanna Pichumani , Arnab Sen
CPC classification number: H05K5/0221 , F16B2/20 , H05K9/0024 , H05K9/0049
Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.
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公开(公告)号：US20220255233A1
公开(公告)日：2022-08-11
申请号：US17732895
申请日：2022-04-29
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Prakash Kurma Raju , Gustavo Fricke
Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device includes a first housing; a second housing rotatably coupled to the first housing; a display screen carried by the second housing; a dual-band antenna carried by the second housing; and a bezel about the display screen, the bezel to cover the dual-band antenna.
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公开(公告)号：US20220015273A1
公开(公告)日：2022-01-13
申请号：US17483415
申请日：2021-09-23
Applicant: Intel Corporation
Inventor： Bala P. Subramanya , Prakash Kurma Raju , Navneet K. Singh , Sachin Bedare , Vijith Halestoph R.
Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
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公开(公告)号：US11139553B2
公开(公告)日：2021-10-05
申请号：US16233791
申请日：2018-12-27
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Prakash Kurma Raju , Prasanna Pichumani , Akarsha Kadadevaramath
Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
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公开(公告)号：US20210034115A1
公开(公告)日：2021-02-04
申请号：US17072639
申请日：2020-10-16
Applicant: Intel Corporation
Inventor： Prasanna Pichumani , Prakash Kurma Raju , Mikko A. Makinen , Vinay Kumar Chandrasekhara , Juha Tapani Paavola , Seppo O. Vesamaki , Timo Herranen
IPC: G06F1/16
Abstract: Computing devices comprise a releasably attachable display assembly to secure a display to a device housing. The display assembly comprises a cover glass to which a display is attached. A retention frame attached to the perimeter of the cover glass comprises a plurality of hooks along one edge and a plurality of snaps along the remaining edges. The hooks and snaps engage with internal retention features along the interior of the housing to secure the display assembly to the housing. A liquid adhesive secures the cover glass to the retention frame. The display assembly further comprises an energy absorber to form a seal between the frame and the housing. The display assembly allows for computing devices with displays that are easily removable for improved serviceability and narrower bezels for improved industrial design.
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公开(公告)号：US20190179377A1
公开(公告)日：2019-06-13
申请号：US16274818
申请日：2019-02-13
Applicant: Intel Corporation
Inventor： Bijendra Singh , Prakash Kurma Raju , Prasanna Pichumani , Kathiravan D
IPC: G06F1/16
Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
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公开(公告)号：US20190131692A1
公开(公告)日：2019-05-02
申请号：US16233791
申请日：2018-12-27
Applicant: Intel Corporation
Inventor： Jayprakash Thakur , Prakash Kurma Raju , Prasanna Pichumani , Akarsha Kadadevaramath
Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
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公开(公告)号：US12082378B2
公开(公告)日：2024-09-03
申请号：US17131137
申请日：2020-12-22
Applicant: Intel Corporation
Inventor： Aleksander Magi , Jeff Ku , Juha Paavola , Prakash Kurma Raju
CPC classification number: H05K7/20454 , F16F7/128 , F16F2222/025 , F16F2230/0023 , F16F2230/48
Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.
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公开(公告)号：US20240175640A1
公开(公告)日：2024-05-30
申请号：US18395919
申请日：2023-12-26
Applicant: Intel Corporation
Inventor： Santosh Gangal , Akarsha Kadadevaramath , Raghavendra S. Kanivihalli , Prakash Kurma Raju , Navneet Singh , Sarma Vmk Vedhanabhatla
IPC: F28D15/04
CPC classification number: F28D15/04
Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.
