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公开(公告)号：US11755080B2
公开(公告)日：2023-09-12
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
CPC classification number: G06F1/203 , G06F1/1616 , G06F1/1637 , G06F1/1647 , G06F1/1681 , H04M1/022 , H05K7/2039 , G06F3/041 , G06F2200/203 , H04M1/0216 , H04M2250/16
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US20220113759A1
公开(公告)日：2022-04-14
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US11551891B2
公开(公告)日：2023-01-10
申请号：US16455576
申请日：2019-06-27
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Raghavendra Doddi , Prasanna Pichumani , Sachin Bedare , Bijendra Singh , Gopinath Kandasamy
IPC: H01H13/84 , H01H13/705 , G06F1/16
Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
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Patent Agency Ranking
公开(公告)号：US20210103317A1
公开(公告)日：2021-04-08
申请号：US17100849
申请日：2020-11-21
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Samarth Alva , Bhavaneeswaran Anbalagan , Triplicane Gopikrishnan Babu , Prasanna Pichumani , Raghavendra Doddi , Sudheera Sudhakar , Ritu Bawa
Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
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公开(公告)号：US11231757B2
公开(公告)日：2022-01-25
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US11206748B2
公开(公告)日：2021-12-21
申请号：US16713430
申请日：2019-12-13
Applicant: Intel Corporation
Inventor： Raghavendra Doddi , Ravishankar Srikanth , Kathiravan D , Prakash Kurma Raju
IPC: H05K7/20
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
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公开(公告)号：US12117876B2
公开(公告)日：2024-10-15
申请号：US17100849
申请日：2020-11-21
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Samarth Alva , Bhavaneeswaran Anbalagan , Triplicane Gopikrishnan Babu , Prasanna Pichumani , Raghavendra Doddi , Sudheera Sudhakar , Ritu Bawa
CPC classification number: G06F1/1681 , G06F1/1618 , G06F1/203 , G06F2200/203
Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
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公开(公告)号：US20190326081A1
公开(公告)日：2019-10-24
申请号：US16455576
申请日：2019-06-27
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Raghavendra Doddi , Prasanna Pichumani , Sachin Bedare , Bijendra Singh , Gopinath Kandasamy
IPC: H01H13/84 , H01H13/705 , G06F1/16
Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
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