- 专利标题： Composite Materials for Electronic Device Chassis and Related Methods
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申请号： US18129524申请日： 2023-03-31
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公开(公告)号： US20240210988A1公开(公告)日： 2024-06-27
- 发明人: David Pidwerbecki , Arvind S , Jeff Ku , Juha Tapani Paavola , Prakash Kurma Raju , Amruta Krishnakumar Ranade , Sudheera Sudhakar , Mousumi Deka , Snehal Chaudhari , Akarsha R. Kadadevaramath
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： G06F1/16
- IPC分类号： G06F1/16 ; B32B5/02 ; B32B5/26 ; C23C14/20 ; C23C14/35 ; C23C16/06
摘要：
Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
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