公开(公告)号：US20210364474A1

公开(公告)日：2021-11-25

申请号：US16881025

申请日：2020-05-22

申请人： Intel Corporation

发明人： Mario Pacheco ,  Odissei Touzanov ,  Jacob Woolsey ,  Deepak Goyal

IPC分类号： G01N29/22 ,  G01R31/28 ,  G01N29/04

摘要： According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

公开(公告)号：US09291576B2

公开(公告)日：2016-03-22

申请号：US14329686

申请日：2014-07-11

申请人： Intel Corporation

发明人： Mario Pacheco ,  Deepak Goyal

IPC分类号： G01J4/00 ,  G01N21/95 ,  H01L21/67 ,  G01N21/88 ,  G01N21/21

CPC分类号： G01N21/9505 ,  G01N21/21 ,  G01N21/8806 ,  G01N2021/216 ,  G01N2201/0612 ,  H01L21/67288

摘要： Generally discussed herein are systems, apparatuses, and methods that can detect a defect in a die. According to an example, a method can include transmitting a first beam of light with a wavelength and optical power configured to produce a reflected beam with at least one milli-Watt of power, linearly polarizing the first beam of light in a specific direction, circularly polarizing the linearly polarized light by a quarter wavelength to create circularly polarized light, directing the circularly polarized light to a device under test, linearly polarizing light reflected off the device under test by a quarter wavelength, or creating an image of the linearly polarized light reflected off the device under test.

摘要翻译： 这里通常讨论的是可以检测模具中的缺陷的系统，装置和方法。 根据一个示例，一种方法可以包括传输具有波长和光功率的第一光束，其被配置为产生具有至少一毫瓦功率的反射光束，以沿着特定方向将第一光束线性偏振 将线性偏振光偏振四分之一波长以产生圆偏振光，将圆偏振光引导到被测器件，将被测器件反射的光线线偏振四分之一波长，或产生反射的线性偏振光的图像 关闭被测设备。

公开(公告)号：US20200166569A1

公开(公告)日：2020-05-28

申请号：US16199092

申请日：2018-11-23

申请人： Intel Corporation

发明人： Mario Pacheco ,  Deepak Goyal

IPC分类号： G01R31/303 ,  G01N23/04

摘要： Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

公开(公告)号：US20180283845A1

公开(公告)日：2018-10-04

申请号：US15476187

申请日：2017-03-31

申请人： Intel Corporation

发明人： Mario Pacheco ,  Manish Dubey ,  Purushotham Kaushik Muthur Srinath ,  Deepak Goyal ,  Liwen Jin

IPC分类号： G01B9/02 ,  G01B11/00

摘要： An interferometer for characterizing a sample, the interferometer including a light emitter to produce a light beam. A wavelength modulator can dither a wavelength of the light beam to produce an input beam having an oscillating wavelength. A beam splitter can be configured to divide the input beam into a reference beam and a measurement beam. The reference beam can reflect from a mirror having a fixed position and return to the beam splitter. The measurement beam can reflect from the sample and return to the beam splitter. The beam splitter can interfere the received reference beam and measurement beam to form an output beam. A detector can convert the output beam to an electrical signal. A processor can control the wavelength modulator, receive the electrical signal, and determine a distance to the sample based on the electrical signal and the oscillating wavelength of the input beam.

公开(公告)号：US09625256B1

公开(公告)日：2017-04-18

申请号：US14757973

申请日：2015-12-23

申请人： Intel Corporation

发明人： Purushotham Kaushik Muthur Srinath ,  Mario Pacheco ,  Deepak Goyal

IPC分类号： G01B11/27

CPC分类号： G01B11/272 ,  H01K3/00 ,  H01L24/00

摘要： Techniques and mechanisms for evaluating misalignment of circuit structures. In an embodiment, infrared (IR) radiation is variously focused on different planes of an assembly including an integrated circuit (IC) chip and a substrate that is to be coupled to, or that is coupled to, the IC chip. The cross-sectional planes include respective structures that variously reflect IR radiation. The reflected IR radiation is measured to create images each representing a corresponding cross-section of the assembly. In another embodiment, respective reference features of the images are identified and evaluated to determine whether a misalignment between the reference features satisfies one or more threshold test conditions.

公开(公告)号：US11506709B2

公开(公告)日：2022-11-22

申请号：US16199092

申请日：2018-11-23

申请人： Intel Corporation

发明人： Mario Pacheco ,  Deepak Goyal

IPC分类号： G01N23/04 ,  G01R31/303

摘要： Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

公开(公告)号：US11346818B2

公开(公告)日：2022-05-31

申请号：US16881025

申请日：2020-05-22

申请人： Intel Corporation

发明人： Mario Pacheco ,  Odissei Touzanov ,  Jacob Woolsey ,  Deepak Goyal

IPC分类号： G01R31/28 ,  G01N29/22 ,  G01N29/04

摘要： According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

公开(公告)号：US20160011122A1

公开(公告)日：2016-01-14

申请号：US14329686

申请日：2014-07-11

申请人： Intel Corporation

发明人： Mario Pacheco ,  Deepak Goyal

IPC分类号： G01N21/95 ,  G01N21/88 ,  G01N21/21 ,  H01L21/67

CPC分类号： G01N21/9505 ,  G01N21/21 ,  G01N21/8806 ,  G01N2021/216 ,  G01N2201/0612 ,  H01L21/67288

摘要： Generally discussed herein are systems, apparatuses, and methods that can detect a defect in a die. According to an example, a method can include transmitting a first beam of light with a wavelength and optical power configured to produce a reflected beam with at least one milli-Watt of power, linearly polarizing the first beam of light in a specific direction, circularly polarizing the linearly polarized light by a quarter wavelength to create circularly polarized light, directing the circularly polarized light to a device under test, linearly polarizing light reflected off the device under test by a quarter wavelength, or creating an image of the linearly polarized light reflected off the device under test.

摘要翻译： 这里通常讨论的是可以检测模具中的缺陷的系统，装置和方法。 根据一个示例，一种方法可以包括传输具有波长和光功率的第一光束，其被配置为产生具有至少一毫瓦功率的反射光束，以沿着特定方向将第一光束线性偏振 将线性偏振光偏振四分之一波长以产生圆偏振光，将圆偏振光引导到被测器件，将被测器件反射的光线线偏振四分之一波长，或产生反射的线性偏振光的图像 关闭被测设备。