公开(公告)号：US20170173718A1

公开(公告)日：2017-06-22

申请号：US14977639

申请日：2015-12-22

Applicant: Industrial Technology Research Institute

Inventor： Yi-Hao Huang ,  Min-Chieh Chou ,  Wen-Hua Zhang ,  Meng-Chi Huang

IPC: B23K1/00 ,  C25D3/46 ,  H01L23/00 ,  C25D5/10 ,  C23C28/00 ,  C25D3/48 ,  C25D3/56

CPC classification number: B23K1/0016 ,  B23K20/002 ,  B23K20/026 ,  B23K20/233 ,  B23K2101/36 ,  B23K2103/12 ,  C23C28/321 ,  C25D3/46 ,  C25D3/48 ,  C25D3/56 ,  C25D5/10 ,  C25D5/48 ,  C25D5/505 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2712 ,  H01L2224/2908 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29172 ,  H01L2224/29186 ,  H01L2224/3201 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/8321 ,  H01L2224/83447 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/83907 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2924/01015 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2924/0103 ,  H01L2924/01017

Abstract: A metal patch suitable for connecting a high-power element and a substrate is provided. The metal patch includes an intermediate metal layer, two first metal layers, and two second metal layers. The first metal layers are respectively disposed on two opposite surfaces of the intermediate metal layer. The intermediate metal layer is located between the first metal layers. The melting point of each of the first metal layers is greater than 800° C. The second metal layers are respectively disposed on the first metal layers. The intermediate metal layer and the first metal layers are located between the second metal layers. The material of each of the second metal layers includes an indium-tin alloy. Each of the first metal layers and the corresponding second metal layer can generate an intermetal via a solid-liquid diffusion reaction.