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    Mold for forming complex 3D MEMS components
    1.
    发明授权
    Mold for forming complex 3D MEMS components 有权
    用于形成复杂3D MEMS部件的模具

    公开(公告)号：US09249015B2

    公开(公告)日：2016-02-02

    申请号：US13778526

    申请日：2013-02-27

    申请人： International Business Machines Corporation ,  Yale University

    发明人： Emily R. Kinser ,  Jan Schroers ,  Golden Kumar

    IPC分类号： B81C99/00 ,  B22C9/06

    CPC分类号： B81C99/009 ,  B22C9/06

    摘要： A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

    摘要翻译： 具有高精度多维成分的模具结构包括：在多个半导体衬底的顶表面上沉积氧化物层，将集成在一个或多个氧化物层中的设计图案化; 重新定位基板以使氧化物层彼此接触; 使用电介质接合顺序地接合重新定位的基板，形成三维（3D）模具; 用填充材料填充3D模具并去除存在于部件顶表面上的覆盖层填充材料。

    DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS
    2.
    发明申请
    DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS 有权
    用于形成复合3D MEMS组件的模具设计

    公开(公告)号：US20140238574A1

    公开(公告)日：2014-08-28

    申请号：US13778526

    申请日：2013-02-27

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  YALE UNIVERSITY

    发明人： Emily R. Kinser ,  Jan Schroers ,  Golden Kumar

    IPC分类号： H01L21/71

    CPC分类号： B81C99/009 ,  B22C9/06

    摘要： A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

    摘要翻译： 具有高精度多维成分的模具结构包括：在多个半导体衬底的顶表面上沉积氧化物层，将集成在一个或多个氧化物层中的设计图案化; 重新定位基板以使氧化物层彼此接触; 使用电介质接合顺序地接合重新定位的基板，形成三维（3D）模具; 用填充材料填充3D模具并去除存在于部件顶表面上的覆盖层填充材料。

    DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS
    3.
    发明申请
    DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS 有权
    用于形成复合3D MEMS组件的模具设计

    公开(公告)号：US20150368100A1

    公开(公告)日：2015-12-24

    申请号：US14839324

    申请日：2015-08-28

    申请人： International Business Machines Corporation ,  Yale University

    发明人： Emily R. Kinser ,  Jan Schroers ,  Golden Kumar

    IPC分类号： B81C99/00

    CPC分类号： B81C99/009 ,  B22C9/06

    摘要： A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.

    摘要翻译： 一种具有高精度多维分量的模具结构，其包括叠加在第一半导体衬底的顶部上的第一氧化物层; 叠加在第二半导体衬底的顶部上的第二氧化物层; 图案化为至少一个氧化物层的集成设计; 以及第一和第二半导体衬底彼此接合成三维（3D）模具，使得第一氧化物层仅与第二氧化物层部分接触，使得第一氧化物层的一部分避免与第二氧化物层接触 ，第一氧化物层的与第二半导体衬底的不含第二氧化物的表面部分直接相对的部分，3D模具选择性地填充有填充材料以形成模制的高精度多维部件。

    Mold for forming complex 3D MEMS components
    4.
    发明授权
    Mold for forming complex 3D MEMS components 有权

    公开(公告)号：US09738517B2

    公开(公告)日：2017-08-22

    申请号：US14839324

    申请日：2015-08-28

    申请人： International Business Machines Corporation ,  Yale University

    发明人： Emily R. Kinser ,  Jan Schroers ,  Golden Kumar

    IPC分类号： B81C99/00 ,  B22C9/06

    CPC分类号： B81C99/009 ,  B22C9/06

    摘要： A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.

    Molding and De-Molding of Metallic Glass Using Non-Disposable Molds
    5.
    发明申请
    Molding and De-Molding of Metallic Glass Using Non-Disposable Molds 审中-公开
    使用非一次性模具的金属玻璃的成型和脱模

    公开(公告)号：US20160318095A1

    公开(公告)日：2016-11-03

    申请号：US15033173

    申请日：2014-10-29

    申请人： YALE UNIVERSITY

    发明人： Jan Schroers ,  Rodrigo Miguel Ojeda Mota ,  Jittisa Ketkaew ,  Punnathat Bordeenithikasem

    IPC分类号： B22C9/06 ,  B22C9/22

    CPC分类号： B22C9/061 ,  B22C9/22 ,  C22C45/10 ,  G04B19/12 ,  G04B37/22

    摘要： A reusable mold comprising a flexible bulk metallic glass mold insert comprising one or more mold cavities removably coupled to a support mold and a method of making the reusable mold. The support mold is removable from the flexible bulk metallic glass mold insert without macroscopic elastic flexing or deforming of the support mold. The reusable mold may be used for molding one or more bulk metallic glass parts and the one or more molded bulk metallic glass parts may be released from the flexible bulk metallic glass mold insert by elastically flexing the flexible mold insert.

    摘要翻译： 一种可重复使用的模具，其包括柔性块状金属玻璃模具插入件，其包括可移除地联接到支撑模具的一个或多个模腔，以及制造可重复使用的模具的方法。 支撑模具可从柔性块状金属玻璃模具插入件移除，而不会支撑模具的宏观弹性挠曲或变形。 可重复使用的模具可以用于模制一个或多个块状金属玻璃部件，并且一个或多个模制的块状金属玻璃部件可以通过弹性弯曲柔性模具插入件而从柔性块状金属玻璃模具插入件释放。

    Method for Imprinting and Erasing Amorphous Metal Alloys
    7.
    发明申请
    Method for Imprinting and Erasing Amorphous Metal Alloys 审中-公开
    非晶态金属合金印刷和擦除方法

    公开(公告)号：US20140186648A1

    公开(公告)日：2014-07-03

    申请号：US14159912

    申请日：2014-01-21

    申请人： Yale University

    发明人： Jan Schroers ,  Golden Kumar ,  Hongxing Tang

    IPC分类号： G11B3/70

    CPC分类号： G11B3/705 ,  C21D6/04 ,  C21D2221/00 ,  C22C45/00 ,  C22C45/001 ,  C22C45/003 ,  C22C45/02 ,  C22C45/04 ,  C22C2200/02 ,  Y10T428/12389

    摘要： The present invention relates to materials, methods and apparatuses for performing imprint lithography using amorphous metallic materials. The amorphous metallic materials can be employed as imprint media and thermoplastic forming processes are applied during the pattern transfer procedure to produce micron scale and nanoscale patterns in the amorphous metallic layer. The pattern transfer is in the form of direct mask embossing or through a serial nano-indentation process. A rewriting process is also disclosed, which involves an erasing mechanism that is accomplished by means of a second thermoplastic forming process. The amorphous metallic materials may also be used directly as an embossing mold in imprint lithography to allow high volume imprint nano-manufacturing. This invention also comprises of a method of smoothening surfaces under the action of the surface tension alone.

    摘要翻译： 本发明涉及使用非晶金属材料进行压印光刻的材料，方法和装置。 非晶金属材料可用作压印介质，并且在图案转移过程期间施加热塑性成形工艺以在非晶金属层中产生微米级和纳米尺度图案。 图案转印是直接掩模压花或通过连续纳米压痕工艺的形式。 还公开了重写过程，其包括通过第二热塑性成型工艺实现的擦除机构。 非晶金属材料也可以直接用作压印光刻中的压花模具，以允许高体积压印纳米制造。 本发明还包括在单独的表面张力的作用下平滑表面的方法。