发明申请
- 专利标题： DESIGN OF A MOLD FOR FORMING COMPLEX 3D MEMS COMPONENTS
- 专利标题（中）： 用于形成复合3D MEMS组件的模具设计
-
申请号： US13778526申请日： 2013-02-27
-
公开(公告)号： US20140238574A1公开(公告)日： 2014-08-28
- 发明人: Emily R. Kinser , Jan Schroers , Golden Kumar
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , YALE UNIVERSITY
- 申请人地址： US CT New Haven US NY Armonk
- 专利权人： Yale University,International Business Machines Corporation
- 当前专利权人： Yale University,International Business Machines Corporation
- 当前专利权人地址： US CT New Haven US NY Armonk
- 主分类号： H01L21/71
- IPC分类号： H01L21/71
摘要：
A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.
公开/授权文献
- US09249015B2 Mold for forming complex 3D MEMS components 公开/授权日：2016-02-02
信息查询
IPC分类:
