-
公开(公告)号：US12023162B2
公开(公告)日：2024-07-02
申请号：US16204607
申请日：2018-11-29
发明人： Hariklia Deligianni , Jason Gerrard , Emily R. Kinser , Themis R. Kyriakides , Dennis D. Spencer , Roy R. Yu , Hitten Zaveri
CPC分类号： A61B5/24 , A61B5/685 , A61N1/0531 , A61N1/36135 , A61B2560/0214 , A61B2562/0209 , A61B2562/028 , A61B2562/0285 , A61B2562/046 , A61B2562/125
摘要： A structure for monitoring and stimulation includes an external power supply unit. The structure also includes an internal hub communicatively coupled to the external power supply unit. The structure further includes a plurality of sensor modules communicatively coupled to the internal hub by a plurality of flexible interconnects. The plurality of sensor modules include three-dimensional (3D) comb sensor devices.
-
公开(公告)号：US20190142310A1
公开(公告)日：2019-05-16
申请号：US16245942
申请日：2019-01-11
IPC分类号： A61B5/1486 , G01N27/327 , A61B5/145 , A61B5/1468
摘要： An electrode structure, which can be used as a biosensor, is provided that has non-random topography located on one surface of an electrode base substrate. The non-random topography of the electrode structure and the electrode base substrate of the electrode structure are of unitary construction and unitary composition and thus there is no interface is located between these elements of the electrode structure.
-
公开(公告)号：US09738517B2
公开(公告)日：2017-08-22
申请号：US14839324
申请日：2015-08-28
发明人： Emily R. Kinser , Jan Schroers , Golden Kumar
CPC分类号： B81C99/009 , B22C9/06
摘要： A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.
-
公开(公告)号：US10213144B2
公开(公告)日：2019-02-26
申请号：US15005690
申请日：2016-01-25
IPC分类号： G01N27/327 , A61B5/1486 , A61B5/145 , A61B5/1468 , B82Y40/00 , B82Y15/00
摘要： An electrode structure, which can be used as a biosensor, is provided that has non-random topography located on one surface of an electrode base substrate. The non-random topography of the electrode structure and the electrode base substrate of the electrode structure are of unitary construction and unitary composition and thus there is no interface is located between these elements of the electrode structure.
-
公开(公告)号：US09249015B2
公开(公告)日：2016-02-02
申请号：US13778526
申请日：2013-02-27
发明人： Emily R. Kinser , Jan Schroers , Golden Kumar
CPC分类号： B81C99/009 , B22C9/06
摘要： A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.
摘要翻译： 具有高精度多维成分的模具结构包括：在多个半导体衬底的顶表面上沉积氧化物层，将集成在一个或多个氧化物层中的设计图案化; 重新定位基板以使氧化物层彼此接触; 使用电介质接合顺序地接合重新定位的基板，形成三维（3D）模具; 用填充材料填充3D模具并去除存在于部件顶表面上的覆盖层填充材料。
-
公开(公告)号：US20140238574A1
公开(公告)日：2014-08-28
申请号：US13778526
申请日：2013-02-27
发明人： Emily R. Kinser , Jan Schroers , Golden Kumar
IPC分类号： H01L21/71
CPC分类号： B81C99/009 , B22C9/06
摘要： A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.
摘要翻译： 具有高精度多维成分的模具结构包括：在多个半导体衬底的顶表面上沉积氧化物层，将集成在一个或多个氧化物层中的设计图案化; 重新定位基板以使氧化物层彼此接触; 使用电介质接合顺序地接合重新定位的基板，形成三维（3D）模具; 用填充材料填充3D模具并去除存在于部件顶表面上的覆盖层填充材料。
-
公开(公告)号：US11013437B2
公开(公告)日：2021-05-25
申请号：US16245942
申请日：2019-01-11
IPC分类号： G01N27/32 , C22C1/10 , A61B5/1486 , A61B5/145 , G01N27/327 , A61B5/1468 , B82Y40/00 , B82Y15/00
摘要： An electrode structure, which can be used as a biosensor, is provided that has non-random topography located on one surface of an electrode base substrate. The non-random topography of the electrode structure and the electrode base substrate of the electrode structure are of unitary construction and unitary composition and thus there is no interface is located between these elements of the electrode structure.
-
8.发明申请公开(公告)号：US20200170523A1
公开(公告)日：2020-06-04
申请号：US16204607
申请日：2018-11-29
发明人： Hariklia Deligianni , Jason Gerrard , Emily R. Kinser , Themis R. Kyriakides , Dennis D. Spencer , Roy R. Yu , Hitten Zaveri
摘要： A structure for monitoring and stimulation includes an external power supply unit. The structure also includes an internal hub communicatively coupled to the external power supply unit. The structure further includes a plurality of sensor modules communicatively coupled to the internal hub by a plurality of flexible interconnects. The plurality of sensor modules include three-dimensional (3D) comb sensor devices.
-
公开(公告)号：US20150368100A1
公开(公告)日：2015-12-24
申请号：US14839324
申请日：2015-08-28
发明人： Emily R. Kinser , Jan Schroers , Golden Kumar
IPC分类号： B81C99/00
CPC分类号： B81C99/009 , B22C9/06
摘要： A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.
摘要翻译： 一种具有高精度多维分量的模具结构，其包括叠加在第一半导体衬底的顶部上的第一氧化物层; 叠加在第二半导体衬底的顶部上的第二氧化物层; 图案化为至少一个氧化物层的集成设计; 以及第一和第二半导体衬底彼此接合成三维（3D）模具，使得第一氧化物层仅与第二氧化物层部分接触，使得第一氧化物层的一部分避免与第二氧化物层接触 ，第一氧化物层的与第二半导体衬底的不含第二氧化物的表面部分直接相对的部分，3D模具选择性地填充有填充材料以形成模制的高精度多维部件。
-
公开(公告)号：US11077475B2
公开(公告)日：2021-08-03
申请号：US15602363
申请日：2017-05-23
摘要： A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.
-
-
-
-
-
-
-
-
-
搜索结果
93 条记录 (耗时 0.019 秒)
