公开(公告)号：US10741515B2

公开(公告)日：2020-08-11

申请号：US16432593

申请日：2019-06-05

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charavanakumara Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/00 ,  H05K3/24

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US10373924B2

公开(公告)日：2019-08-06

申请号：US15967820

申请日：2018-05-01

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charavanakumara Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H05K3/24 ,  H01L23/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US20180247908A1

公开(公告)日：2018-08-30

申请号：US15967820

申请日：2018-05-01

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charavanakumara Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/00 ,  H05K3/24

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US09966351B2

公开(公告)日：2018-05-08

申请号：US15246382

申请日：2016-08-24

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/48 ,  H01L23/00 ,  H05K3/24

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US20190287937A1

公开(公告)日：2019-09-19

申请号：US16432593

申请日：2019-06-05

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charavanakumara Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/00 ,  H05K3/24

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US20160365325A1

公开(公告)日：2016-12-15

申请号：US15246382

申请日：2016-08-24

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US09449936B2

公开(公告)日：2016-09-20

申请号：US14641056

申请日：2015-03-06

申请人： INTEL CORPORATION

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/48 ,  H01L23/00 ,  H05K3/24

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.