NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240063218A1

    公开(公告)日:2024-02-22

    申请号:US17618897

    申请日:2021-11-12

    CPC classification number: H01L27/085 H01L21/8252 H01L23/5221

    Abstract: A nitride-based semiconductor device includes a first nitride-based semiconductor layer, a second nitride-based semiconductor layer, a first nitride-based transistor, and a second nitride-based transistor. The first nitride-based transistor applies the 2DEG region as a channel thereof and comprising a first drain electrode that makes contact with the second nitride-based semiconductor layer to form a first Schottky diode with the second nitride-based semiconductor layer. The second nitride-based transistor applies the 2DEG region as a channel thereof and includes a second drain electrode that makes contact with the second nitride-based semiconductor layer to form a second Schottky diode with the second nitride-based semiconductor layer, such that the first Schottky diode and the second Schottky diode are connected to the same node.

    NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220376074A1

    公开(公告)日:2022-11-24

    申请号:US17417120

    申请日:2021-05-03

    Abstract: A nitride-based semiconductor device includes a first and second nitride-based semiconductor layers, a doped III-V semiconductor layer, a gate electrode, a first and second source/drain (S/D) electrodes. The doped III-V semiconductor layer is disposed over the second nitride-based semiconductor layer and has first and second current-leakage barrier portions which extends downward from atop surface of the doped III-V semiconductor layer. The gate electrode is disposed above the doped III-V semiconductor layer, in which the gate electrode has a pair of opposite edges between the first and second current-leakage barrier portions. One of the edges of the gate electrode coincides with the first current-leakage barrier portion. The first current-leakage barrier portion is located between the first S/D electrode and the gate electrode. The second current-leakage barrier portion is located between the second S/D electrode and the gate electrode.

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