公开(公告)号：US20220005754A1

公开(公告)日：2022-01-06

申请号：US17031486

申请日：2020-09-24

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Ren-Shin CHENG ,  Shih-Hsien WU ,  Yu-Wei HUANG ,  Chih Ming SHEN ,  Yi-Chieh TSAI

IPC分类号： H01L23/495 ,  H01L23/498

摘要： A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.

公开(公告)号：US20160174360A1

公开(公告)日：2016-06-16

申请号：US14950584

申请日：2015-11-24

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Chien-Min HSU ,  Shih-Hsien WU ,  Jing-Yao CHANG ,  Tao-Chih CHANG ,  Ren-Shin CHENG ,  Min-Lin LEE

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K3/42 ,  H05K3/06 ,  H05K3/18 ,  H05K1/11 ,  H01P11/00

CPC分类号： H05K1/116 ,  H05K1/0251 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/09545 ,  H05K2203/1105 ,  H05K2203/1178 ,  H05K2203/143 ,  H05K2203/1438

摘要： A signal transmission board includes a substrate, a conductive via, a cavity and a connecting hole. The substrate has a first external surface and a second external surface. The conductive via penetrating through the substrate has a first end and a second end. The first end is disposed on the first external surface, and the second end is disposed on the second external surface. The cavity is disposed in the substrate and penetrated by the conductive via. The connecting hole disposed on the substrate has a third end and a fourth end. The third end is disposed on the first external surface, and the fourth end communicates with the cavity.

摘要翻译： 信号传输板包括基板，导电孔，空腔和连接孔。 基板具有第一外表面和第二外表面。 穿透基板的导电通孔具有第一端和第二端。 第一端设置在第一外表面上，第二端设置在第二外表面上。 空腔设置在基板中并被导电通孔穿透。 设置在基板上的连接孔具有第三端和第四端。 第三端设置在第一外表面上，第四端与空腔连通。