公开(公告)号：US20180177044A1

公开(公告)日：2018-06-21

申请号：US15387604

申请日：2016-12-21

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Chien-Min HSU ,  Shih-Hsien WU

IPC分类号： H05K1/02 ,  H01P3/08

CPC分类号： H05K1/0245 ,  H01P1/227 ,  H01P3/026 ,  H03H7/38 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/0187

摘要： A differential signal transmitting circuit board includes a substrate, at least two differential conductive elements, and at least one insulating element. The differential conductive elements are disposed in the substrate. The insulating element is disposed in the substrate. The insulating element is close to or contacted to the differential conductive elements. A material of the substrate has a first equivalent dielectric constant. A material of the insulating element has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.

公开(公告)号：US20220400549A1

公开(公告)日：2022-12-15

申请号：US17498606

申请日：2021-10-11

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Chien-Min HSU

IPC分类号： H05K1/05 ,  H01Q1/24 ,  H05K1/18

摘要： An antenna module comprises: a circuit board, having a three-dimensional keep-out area; an antenna, disposed on the circuit board and located in the keep-out area; and a metal piece, disposed on the circuit board and located in the keep-out area, wherein the metal piece is electrically insulated from the antenna.

公开(公告)号：US20210202367A1

公开(公告)日：2021-07-01

申请号：US16923554

申请日：2020-07-08

申请人： Industrial Technology Research Institute

发明人： Chien-Min HSU ,  Chih-Ming SHEN

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31

摘要： A package structure is provided. The package structure includes a substrate. The package structure also includes a hybrid pad disposed on the substrate. The hybrid pad includes a metal layer and a buffer layer connected to the metal layer. The Young's modulus of the buffer layer is less than the Young's modulus of the metal layer. The package structure further includes an electrically connecting structure disposed on the hybrid pad. The package structure includes a chip layer electrically connected to the electrically connecting structure. The package structure also includes a bonding pad disposed between the electrically connecting structure and the chip layer.

公开(公告)号：US20160174360A1

公开(公告)日：2016-06-16

申请号：US14950584

申请日：2015-11-24

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Chien-Min HSU ,  Shih-Hsien WU ,  Jing-Yao CHANG ,  Tao-Chih CHANG ,  Ren-Shin CHENG ,  Min-Lin LEE

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K3/42 ,  H05K3/06 ,  H05K3/18 ,  H05K1/11 ,  H01P11/00

CPC分类号： H05K1/116 ,  H05K1/0251 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/09545 ,  H05K2203/1105 ,  H05K2203/1178 ,  H05K2203/143 ,  H05K2203/1438

摘要： A signal transmission board includes a substrate, a conductive via, a cavity and a connecting hole. The substrate has a first external surface and a second external surface. The conductive via penetrating through the substrate has a first end and a second end. The first end is disposed on the first external surface, and the second end is disposed on the second external surface. The cavity is disposed in the substrate and penetrated by the conductive via. The connecting hole disposed on the substrate has a third end and a fourth end. The third end is disposed on the first external surface, and the fourth end communicates with the cavity.

摘要翻译： 信号传输板包括基板，导电孔，空腔和连接孔。 基板具有第一外表面和第二外表面。 穿透基板的导电通孔具有第一端和第二端。 第一端设置在第一外表面上，第二端设置在第二外表面上。 空腔设置在基板中并被导电通孔穿透。 设置在基板上的连接孔具有第三端和第四端。 第三端设置在第一外表面上，第四端与空腔连通。