公开(公告)号：US20150060932A1

公开(公告)日：2015-03-05

申请号：US14329235

申请日：2014-07-11

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Meng-Chi HUANG ,  Wen-Hua ZHANG ,  Tune-Hune KAO ,  Min-Chieh CHOU ,  Chih-Yu KO

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/648 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A liquid-filled packaging structure of a heating component includes a main body, at least one heating component and a channel. The main body includes an accommodating space, a first opening connecting with the accommodating space and a second opening connecting with the accommodating space. The heating component is disposed in the accommodating space. The two opposite ends of the channel connect with the first opening and the second opening, respectively, so as to form a circulation loop. The accommodating space and the channel are filled with a liquid.

Abstract translation: 加热部件的液体填充包装结构包括主体，至少一个加热部件和通道。 主体包括容纳空间，与容纳空间连接的第一开口和与容纳空间连接的第二开口。 加热部件设置在容纳空间中。 通道的两个相对端分别与第一开口和第二开口连接，以形成循环回路。 容纳空间和通道充满液体。

公开(公告)号：US20240164069A1

公开(公告)日：2024-05-16

申请号：US18086062

申请日：2022-12-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yue-Zhen HUANG ,  Meng-Chi HUANG ,  Tune-Hune KAO ,  Min-Chieh CHOU ,  Jie-Chi CHEN

IPC: H05K7/20 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10166

Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.

公开(公告)号：US20150122533A1

公开(公告)日：2015-05-07

申请号：US14323248

申请日：2014-07-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tune-Hune KAO ,  Meng-Chi HUANG ,  Min-Chieh CHOU

IPC: H05K1/09 ,  C23C18/16 ,  H05K3/18 ,  C09D5/24

CPC classification number: C23C18/1651 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0209

Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Abstract translation: 提供金属电路结构，形成金属电路的方法和用于形成金属电路的液体触发材料。 金属电路结构包括基板，第一触发层和第一金属电路层。 第一触发层设置在基板上并且包括第一金属电路图案。 第一金属电路层设置在第一电路图案上并与基板电绝缘。 第一触发层的组成包括绝缘凝胶和多个触发颗粒。 触发颗粒是有机金属颗粒，螯合剂和能隙大于或等于3eV的半导体材料中的至少一种。 触发颗粒设置在绝缘凝胶中，使得固化后的第一触发层的介电常数在2和6.5之间。

公开(公告)号：US20170029953A1

公开(公告)日：2017-02-02

申请号：US15290668

申请日：2016-10-11

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tune-Hune KAO ,  Meng-Chi HUANG ,  Min-Chieh Chou

IPC: C23C18/16 ,  H05K1/03 ,  C09D5/24 ,  H05K3/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/10

CPC classification number: C23C18/1651 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0209

Abstract: A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Abstract translation: 提供了金属电路结构。 金属电路结构包括基板，第一触发层和第一金属电路层。 第一触发层设置在基板上并且包括第一金属电路图案。 第一金属电路层设置在第一电路图案上并与基板电绝缘。 第一触发层的组成包括绝缘凝胶和多个触发颗粒。 触发颗粒是有机金属颗粒，螯合剂和能隙大于或等于3eV的半导体材料中的至少一种。 触发颗粒设置在绝缘凝胶中，使得固化后的第一触发层的介电常数在2和6.5之间。

公开(公告)号：US20150014719A1

公开(公告)日：2015-01-15

申请号：US14086774

申请日：2013-11-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Sheng JAO ,  Wen-Hua ZHANG ,  Dar-Weei SHYU ,  Meng-Chi HUANG ,  Yao-Chi PENG

IPC: H01L33/50

CPC classification number: H01L33/504 ,  H01L33/507 ,  H01L33/508

Abstract: A light-emitting diode chip includes an illuminating body and a first phosphor layer. The first phosphor layer is disposed on the illuminating body, and the first phosphor layer includes multiple first phosphor powder groups and multiple second phosphor powder groups. The illuminating body has a first emission wavelength, the first phosphor powder groups have a second emission wavelength, and the second phosphor powder groups have a third emission wavelength. The first wavelength is smaller than the second emission wavelength, and the second emission wavelength is smaller than the third emission wavelength.

Abstract translation: 发光二极管芯片包括照明体和第一荧光体层。 第一荧光体层设置在照明体上，第一荧光体层包含多个第一荧光体粉末组和多个第二荧光体粉末组。 照明体具有第一发光波长，第一荧光体粉末组具有第二发光波长，第二荧光体粉末组具有第三发光波长。 第一波长小于第二发射波长，第二发射波长小于第三发射波长。