公开(公告)号：US20230246020A1

公开(公告)日：2023-08-03

申请号：US18295743

申请日：2023-04-04

申请人： II-VI Delaware, Inc.

发明人： Adolf SCHONER ,  Nicolas THIERRY-JEBALI ,  Christian VIEIDER ,  Sergey RESHANOV ,  Hossein ELAHIPANAH ,  Wlodzimierz KAPLAN

IPC分类号： H01L27/06 ,  H01L21/82 ,  H01L29/06 ,  H01L29/10 ,  H01L29/16 ,  H01L29/36 ,  H01L29/417 ,  H01L29/66 ,  H01L29/78

CPC分类号： H01L27/0605 ,  H01L21/8213 ,  H01L27/0629 ,  H01L29/0615 ,  H01L29/0623 ,  H01L29/1095 ,  H01L29/1608 ,  H01L29/36 ,  H01L29/41741 ,  H01L29/66068 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/7813

摘要： A modular concept for Silicon Carbide power devices is disclosed where a low voltage module (LVM) is designed separately from a high voltage module (HVM). The LVM having a repeating structure in at least a first direction, the repeating structure repeats with a regular distance in at least the first direction, the HVM comprising a buried grid (4) with a repeating structure in at least a second direction, the repeating structure repeats with a regular distance in at least the second direction, along any possible defined direction. Advantages include faster easier design and manufacture at a lower cost.