公开(公告)号：US3416224A

公开(公告)日：1968-12-17

申请号：US53275466

申请日：1966-03-08

Applicant: IBM

Inventor： ARMSTRONG WILLIAM J ,  HEALY ALBERT M ,  DUFFY MICHAEL C

IPC: H01L21/762 ,  H01L21/764 ,  H01L23/29

CPC classification number: H01L21/764 ,  H01L21/76264 ,  H01L21/76275 ,  H01L21/76289 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S148/043 ,  Y10S148/085 ,  H01L2924/00

公开(公告)号：US3577044A

公开(公告)日：1971-05-04

申请号：US3577044D

申请日：1968-04-08

Applicant: IBM

Inventor： ARMSTRONG WILLIAM J ,  HEALY ALBERT M ,  DUFFY MICHAEL C

IPC: H01L21/762 ,  H01L23/29 ,  H01L19/00

CPC classification number: H01L21/76297 ,  H01L21/76264 ,  H01L21/76275 ,  H01L21/76289 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S148/085 ,  H01L2924/00

Abstract: This invention is directed generally to integrated semiconductor devices including fabrication methods therefor and, more particularly, to insulator encapsulated, dielectrically isolated, integrated semiconductor devices including fabrication methods therefor.

公开(公告)号：US3490962A

公开(公告)日：1970-01-20

申请号：US3490962D

申请日：1966-04-25

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  KENNEDY DAVID P ,  MURLEY PHILIP C ,  ARMSTRONG WILLIAM J ,  SEABOLDT JACK JAY

IPC: H01L21/00 ,  H01L21/22 ,  H01L29/00 ,  H01L7/44

CPC classification number: H01L21/22 ,  H01L21/00 ,  H01L29/00 ,  Y10S148/043 ,  Y10S148/106 ,  Y10S148/167