Memory, Memory Use Method, Memory Manufacturing Method, and Electronic Device

    公开(公告)号:US20240331739A1

    公开(公告)日:2024-10-03

    申请号:US18741084

    申请日:2024-06-12

    IPC分类号: G11C5/06 G11C7/10

    CPC分类号: G11C5/063 G11C7/1048

    摘要: This disclosure discloses a memory, a memory use method, a memory manufacturing method, and an electronic device. The memory includes a control layer and at least one storage layer stacked on the control layer. The storage layer includes a plurality of storage channels, and each storage channel includes an independent data interface bus. The control layer includes a plurality of controllers and a plurality of user interfaces, the controller is configured to access data stored in a storage channel connected to the controller. The plurality of controllers are connected to the data interface buses of the plurality of storage channels in one-to-one correspondence. A quantity of user interfaces is the same as a quantity of user storage channels that can be invoked by a user. The quantity of user interfaces is less than a quantity of controllers.

    Stacked memory and storage system

    公开(公告)号:US12014058B2

    公开(公告)日:2024-06-18

    申请号:US18146996

    申请日:2022-12-27

    摘要: A stacked memory includes a volatile memory die and a non-volatile memory die that are stacked together. The non-volatile memory die includes a non-volatile storage array and a peripheral circuit. The peripheral circuit includes a power integrity circuit and a signal integrity circuit. The power integrity circuit is configured to perform power integrity optimization on a power supply obtained from a lower-layer die and then transmit the power supply to an upper-layer die. The signal integrity circuit is configured to perform signal integrity optimization on a signal obtained from a lower-layer die and then transmit the signal to an upper-layer die.

    Thin Film Transistor and Manufacturing Method, Memory and Manufacturing Method, and Electronic Device

    公开(公告)号:US20230371229A1

    公开(公告)日:2023-11-16

    申请号:US18358434

    申请日:2023-07-25

    IPC分类号: H10B12/00

    CPC分类号: H10B12/00

    摘要: A thin-film transistor (TFT) includes a gate, a first electrode, a second electrode, a first dielectric layer, a second dielectric layer, and a semiconductor layer. The gate includes a gate base located at a top portion and a gate body extending from the gate base to a bottom portion. The first electrode is located at the bottom portion. The second electrode is located between the first electrode and the gate base. The first dielectric layer is disposed between the second electrode and the first electrode, and the first dielectric layer is configured to separate the first electrode from the second electrode. The second dielectric layer covers a surface of the gate base and a surface of the gate body. The semiconductor layer is disposed along a side surface of the gate body, and the second dielectric layer separates the semiconductor layer from the gate.

    MEMORY AND FORMING METHOD THEREOF, AND ELECTRONIC DEVICE

    公开(公告)号:US20240121942A1

    公开(公告)日:2024-04-11

    申请号:US18542615

    申请日:2023-12-16

    IPC分类号: H10B12/00

    摘要: A memory comprises a substrate and a plurality of storage units formed on the substrate. Each of the storage units includes a transistor and a capacitor electrically connected to the transistor. The transistor includes a gate, a semiconductor layer, a first electrode, a second electrode, and a gate dielectric layer. The first electrode and the second electrode are arranged in a first direction. The gate is located between the first electrode and the second electrode. The semiconductor layer is located on one of two opposite sides of the gate in a second direction. The semiconductor layer is electrically connected separately to the first electrode and the second electrode, the gate and the semiconductor layer are isolated from each other by the gate dielectric layer, and the second direction is a direction parallel to the substrate.

    Storage controller and data migration monitoring method

    公开(公告)号:US11809730B2

    公开(公告)日:2023-11-07

    申请号:US17389461

    申请日:2021-07-30

    IPC分类号: G06F12/00 G06F3/06

    摘要: A storage controller is coupled to a memory, and the memory includes a first storage area and a second storage area. The storage controller includes a data migration circuit and a data operation determining circuit. The data migration circuit is configured to generate a migration signal, to migrate data in the first storage area to the second storage area. In a process in which the data migration circuit migrates all the data in the first storage area to the second storage area, the data operation determining circuit is configured to: receive and monitor a data operation signal input to the memory, and output a data migration failure signal when detecting that the data operation signal is a data modify signal with respect to the first storage area.

    STACKED MEMORY AND STORAGE SYSTEM

    公开(公告)号:US20230139599A1

    公开(公告)日:2023-05-04

    申请号:US18146996

    申请日:2022-12-27

    IPC分类号: G06F3/06

    摘要: A stacked memory includes a volatile memory die and a non-volatile memory die that are stacked together. The non-volatile memory die includes a non-volatile storage array and a peripheral circuit. The peripheral circuit includes a power integrity circuit and a signal integrity circuit. The power integrity circuit is configured to perform power integrity optimization on a power supply obtained from a lower-layer die and then transmit the power supply to an upper-layer die. The signal integrity circuit is configured to perform signal integrity optimization on a signal obtained from a lower-layer die and then transmit the signal to an upper-layer die.