公开(公告)号：US12113095B2

公开(公告)日：2024-10-08

申请号：US17205805

申请日：2021-03-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaowei Zou ,  Chengbo Qiu ,  Haisheng Lu

IPC: H01F27/28 ,  H01F5/00 ,  H01L49/02

CPC classification number: H01L28/10 ,  H01F5/003 ,  H01F27/28

Abstract: This application discloses a planar inductor. The planar inductor includes a first inductor module and a second inductor module that are connected in parallel. A direction of a magnetic line of the first inductor module is opposite to a direction of a magnetic line of the second inductor module, so that the magnetic lines can form a self-close loop in the planar inductor, and impact of a far magnetic field generated by the inductor on the outside, especially a nearby inductor, can be greatly reduced, thereby reducing crosstalk between the inductors, that is, reducing a phase noise, and increasing a Q value of the inductor. In addition, this application further provides a semiconductor chip that includes the planar inductor.

公开(公告)号：US20140045372A1

公开(公告)日：2014-02-13

申请号：US14058419

申请日：2013-10-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Wang ,  Junlin Zou ,  Xiaowei Zou

IPC: H01R13/52 ,  H01R43/00

CPC classification number: H01R13/5213 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/05095 ,  H01L2224/05096 ,  H01L2224/05558 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/12041 ,  H01L2924/14 ,  H01R43/005 ,  Y10T29/49204 ,  H01L2924/00

Abstract: The present invention discloses a waterproof structure of a pad, a waterproof pad, and a method for forming the waterproof structure. The waterproof structure includes a first dielectric layer, having an annular hollowed-out recess along the periphery of the first dielectric layer and a metal annular zone formed in the annular hollowed-out recess, and a second dielectric layer, formed above the first dielectric layer and located under the pad and having multiple first through-holes along the periphery of the second dielectric layer and multiple metal posts formed in the multiple first through-holes, where the multiple first through-holes form a hollow annular through-hole chain and the metal annular zone maintains an electrical connection with the multiple metal posts.

Abstract translation: 本发明公开了一种垫的防水结构，防水垫，以及防水结构的形成方法。 防水结构包括：第一电介质层，具有沿着第一电介质层的周边的环形中空凹槽和形成在环形中空凹槽中的金属环形区，以及第二电介质层，形成在第一介电层 并且位于所述垫下方并且具有沿着所述第二介电层的周边的多个第一通孔和形成在所述多个第一通孔中的多个金属柱，其中所述多个第一通孔形成中空的环形通孔链，并且 金属环形区域与多个金属柱保持电连接。

公开(公告)号：US10069236B2

公开(公告)日：2018-09-04

申请号：US14058419

申请日：2013-10-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jun Wang ,  Junlin Zou ,  Xiaowei Zou

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R13/52 ,  H01L23/00 ,  H01R43/00

Abstract: The present invention discloses a waterproof structure of a pad, a waterproof pad, and a method for forming the waterproof structure. The waterproof structure includes a first dielectric layer, having an annular hollowed-out recess along the periphery of the first dielectric layer and a metal annular zone formed in the annular hollowed-out recess, and a second dielectric layer, formed above the first dielectric layer and located under the pad and having multiple first through-holes along the periphery of the second dielectric layer and multiple metal posts formed in the multiple first through-holes, where the multiple first through-holes form a hollow annular through-hole chain and the metal annular zone maintains an electrical connection with the multiple metal posts.