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    Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
    3.
    发明申请
    Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same 审中-公开
    树脂组合物，以及使用其制备的预浸料和印刷电路板

    公开(公告)号：US20120097437A1

    公开(公告)日：2012-04-26

    申请号：US13006530

    申请日：2011-01-14

    Applicant: Shih-Hao Liao ,  Chih-Wei Liao ,  Hsuan-Hao Hsu ,  Hsien-Te Chen ,  Tsung-Hsien Lin

    Inventor： Shih-Hao Liao ,  Chih-Wei Liao ,  Hsuan-Hao Hsu ,  Hsien-Te Chen ,  Tsung-Hsien Lin

    IPC: H05K1/03 ,  C08K3/34 ,  C08L63/00

    CPC classification number: H05K1/0373 ,  C08G59/4014 ,  C08L63/00 ,  H05K1/0366 ,  H05K3/022

    Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a polymer solution as a hardener, which is prepared by the following steps: (a) dissolving an N,O-heterocyclic compound into a first solvent to form a first reaction solution, wherein the N,O-heterocyclic compound is of Formula I or Formula II: wherein, R1 to R3, W1, W2, m, n, p and q are defined in the specification; (b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization; and (c) cooling the first reaction solution to a second temperature to substantially terminate the ring-opening polymerization, and thus obtain the polymer solution, wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature, and wherein, the amount of the hardener, based on the solid, is about 20 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin.

    Abstract translation: 提供树脂组合物。 树脂组合物包含：环氧树脂; 作为硬化剂的聚合物溶液，其通过以下步骤制备：（a）将N，O-杂环化合物溶解在第一溶剂中以形成第一反应溶液，其中所述N，O-杂环化合物为式I或 式II：其中，R1至R3，W1，W2，m，n，p和q在说明书中定义; （b）将第一反应溶液加热至第一温度以进行开环聚合; 和（c）将第一反应溶液冷却至第二温度以基本上终止开环聚合，从而获得聚合物溶液，其中第一溶剂对N，O-杂环化合物不反应; 第一温度高于N，O-杂环化合物的软化温度，低于第一溶剂的沸点; 并且第二温度低于第一温度，并且其中，基于固体的固化剂的量为每100重量份环氧树脂约20重量份至约200重量份。

    Colorful lamp strip
    8.
    发明授权
    Colorful lamp strip 失效
    五颜六色的灯条

    公开(公告)号：US06517219B1

    公开(公告)日：2003-02-11

    申请号：US10101409

    申请日：2002-03-20

    Applicant: Hsien-Te Chen

    Inventor： Hsien-Te Chen

    IPC: F21V2100

    CPC classification number: F21V19/007 ,  F21S4/22 ,  F21V9/08 ,  F21V19/0005 ,  F21V27/00 ,  Y10S362/806

    Abstract: An lamp strip with a heat shrinkage tube provided with portions of different colors is disclosed. The lamp strip includes an elongate bar defining a plurality of bores spaced along the bar. A groove is defined in an outer surface of the bar and coextensive therewith. A light emitting element is received and retained in each bore. Each light emitting element has first and second wires received in and extending along the groove. The second wire of each bulb is jointed to the first wire of an adjacent bulb. The joint can be formed by simply twisting the wires together or by means of a connection element. The jointed portion of the wires is received in the corresponding cavity. The heat shrinkage tube having colorful patterns thereon or constituted by sections of different colors is fit over and encompassing the elongate bar. A light-transmitting outer tube made of plastics is then fit over the heat shrinkage tube. By means of the colorful portions of the heat shrinkage tube, the light emitted from the light emitting element is colored and display colorful light patterns to an observer.

    Abstract translation: 公开了一种具有设置有不同颜色的部分的热收缩管的灯条。 灯条包括限定沿着杆间隔开的多个孔的细长杆。 凹槽限定在杆的外表面并与其共同延伸。 发光元件被接收并保持在每个孔中。 每个发光元件具有容纳在凹槽中并沿凹槽延伸的第一和第二导线。 每个灯泡的第二根线连接到相邻灯泡的第一根导线上。 接头可以通过简单地将电线绞合在一起或通过连接元件形成。 电线的接合部分被接收在相应的空腔中。 在其上具有彩色图案的热收缩管或由不同颜色的部分构成的热收缩管被装配并包围细长条。 然后将由塑料制成的透光外管装配在热收缩管上。 通过热收缩管的多彩部分，从发光元件发射的光被着色并向观察者显示彩色光图案。

    System and measuring access time of embedded memories
    9.
    发明授权
    System and measuring access time of embedded memories 有权
    嵌入式存储器的系统和测量访问时间

    公开(公告)号：US06424583B1

    公开(公告)日：2002-07-23

    申请号：US09726729

    申请日：2000-11-30

    Applicant: Nai-Yin Sung ,  Tsung-Yi Wu ,  Meng-Fan Chang ,  Hsien-Te Chen

    Inventor： Nai-Yin Sung ,  Tsung-Yi Wu ,  Meng-Fan Chang ,  Hsien-Te Chen

    IPC: G11C700

    CPC classification number: G11C29/028 ,  G11C11/41 ,  G11C29/50 ,  G11C2207/104

    Abstract: A BIST controller and a separate measurement circuit are used to determine the maximum time period for accessing data stored in an embedded integrated circuit memory. The BIST controller includes a finite state controller for controlling the state of said BIST, a pattern generator for generating a patterned stimulus to be applied to the memory, and a comparator for comparing the response of said memory to said stimulus, to a reference response. The measurement circuit includes a pair of logic circuits for respectively operating on “1's” and “0's” data read from the memory, and a plurality of time delay elements that introduce time delays in the data prior to delivery to the logic circuits.

    Abstract translation: 使用BIST控制器和单独的测量电路来确定用于访问存储在嵌入式集成电路存储器中的数据的最大时间段。 BIST控制器包括用于控制所述BIST的状态的有限状态控制器，用于产生要施加到存储器的图案化激励的模式发生器，以及用于将所述存储器的响应与所述刺激进行比较的比较器与参考响应。 测量电路包括用于分别对从存储器读取的“1”和“0”数据进行操作的一对逻辑电路，以及在传送到逻辑电路之前在数据中引入时间延迟的多个时间延迟元件。

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