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    Heater supporting device
    1.
    发明授权
    Heater supporting device 有权

    公开(公告)号：US09779970B2

    公开(公告)日：2017-10-03

    申请号：US13101625

    申请日：2011-05-05

    申请人： Tetsuya Kosugi ,  Hitoshi Murata ,  Shinobu Sugiura ,  Masaaki Ueno

    发明人： Tetsuya Kosugi ,  Hitoshi Murata ,  Shinobu Sugiura ,  Masaaki Ueno

    IPC分类号： H01L21/22 ,  H01L21/67

    CPC分类号： H01L21/67109

    摘要： A heater supporting device for use in a semiconductor manufacturing apparatus is provided so as to improve the uniformity of a temperature property and the expected lifespan by preventing support pieces from being damaged and separated from piece holders, and preventing deterioration in adiabatic efficiency in the vicinity of a ceiling of a vertical type furnace. A heating element of a coil shape is disposed around an object. The support pieces are vertically connected in multiple. Hollows of an elliptical shape are formed between the respective support pieces. Concave insertions are formed on one of upper and lower surfaces of the respective support pieces, and convex insertions are formed on the other one of the upper and lower surfaces of the respective support pieces. The convex insertions are insert-fitted with the concave insertions. The support pieces are vertically connected in multiple by insert-fitting the concave insertions to the convex insertions.

    Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
    2.
    发明授权
    Heating device, substrate processing apparatus, and method of manufacturing semiconductor device 有权
    加热装置，基板处理装置以及半导体装置的制造方法

    公开(公告)号：US09064912B2

    公开(公告)日：2015-06-23

    申请号：US12838831

    申请日：2010-07-19

    申请人： Hitoshi Murata ,  Tetsuya Kosugi ,  Shinobu Sugiura ,  Masaaki Ueno

    发明人： Hitoshi Murata ,  Tetsuya Kosugi ,  Shinobu Sugiura ,  Masaaki Ueno

    IPC分类号： H05B3/02 ,  H05B3/06 ,  H01L21/26 ,  H01L21/67

    CPC分类号： H01L21/67109

    摘要： A heating device includes: a heating element including a mountain part and a valley part alternately connected in plurality to form a meander shape, and a holding body receiving part an end of the valley part, where a width of the holding body receiving part is greater than that of the valley part; an insulating body installed at an outer circumference of the heating element with both ends of the heating element fixed thereto; and a staple pin penetrating the holding body receiving part and a neighboring holdings body receiving part to fix the heating element to the insulating body, where the staple pin is dislocated with respect to a center of the holding body receiving part and an amount of dislocation of the staple pin varies according to a distance between the holding body receiving part and the both ends.

    摘要翻译： 一种加热装置，包括：加热元件，其包括多个交替连接以形成曲折形状的山部和谷部;以及保持体容纳部，其中，所述保持体容纳部的宽度较大 比谷部分; 绝热体，其安装在所述加热元件的外周上，所述加热元件的两端固定在所述加热元件的外周; 以及穿过保持体接收部的钉销和相邻的保持体接收部，以将加热元件固定在绝缘体上，在该绝缘体处，钉销相对于保持体接收部的中心脱位， 钉销根据保持体接收部和两端之间的距离而变化。

    Heating device having a meander-shaped heating element with an insulating body accomodating the same, and the substrate processing apparatus including the same
    5.
    发明授权
    Heating device having a meander-shaped heating element with an insulating body accomodating the same, and the substrate processing apparatus including the same 有权
    具有带有绝缘体的曲折形加热元件的加热装置和包括该加热元件的基板处理装置

    公开(公告)号：US08847124B2

    公开(公告)日：2014-09-30

    申请号：US12748920

    申请日：2010-03-29

    申请人： Hitoshi Murata ,  Tetsuya Kosugi ,  Shinobu Sugiura

    发明人： Hitoshi Murata ,  Tetsuya Kosugi ,  Shinobu Sugiura

    IPC分类号： H05B3/02

    CPC分类号： H01L21/324 ,  H01L21/67109

    摘要： Provided are a heating device, a substrate processing apparatus, and a method of manufacturing a semiconductor device, which can suppress differences between heating bodies, and simultaneously, can suppress shearing of a holder due to thermal deformation of the heating element. The heating device comprises: a heating element including a mountain part and a valley part that are alternately connected in plurality in a meander shape with both ends being fixed; holding body receiving parts respectively installed at ends of the valley parts and formed as cutout parts having a width larger than a width of the valley part; an insulating body installed at an outer circumference of the heating element; and a holding body disposed in the holding body receiving part and fixed to the insulating body.

    摘要翻译： 提供一种加热装置，基板处理装置和半导体装置的制造方法，其能够抑制加热体之间的差异，同时能够抑制由于加热元件的热​​变形引起的保持器的剪切。 加热装置包括：加热元件，其包括山形部分和谷部分，其以固定的两端交替连接成多个弯曲形状; 保持体接纳部，分别安装在谷部的端部，形成为宽度大于谷部宽度的切口部; 安装在所述加热元件的外周的绝缘体; 以及保持体，其设置在所述保持体容纳部中并固定到所述绝缘体。

    Substrate processing apparatus and heating equipment
    6.
    发明授权
    Substrate processing apparatus and heating equipment 有权
    基板加工设备和加热设备

    公开(公告)号：US09460946B2

    公开(公告)日：2016-10-04

    申请号：US13177306

    申请日：2011-07-06

    申请人： Hitoshi Murata ,  Tetsuya Kosugi

    发明人： Hitoshi Murata ,  Tetsuya Kosugi

    IPC分类号： F24F7/00 ,  H01L21/67 ,  C23C16/46

    CPC分类号： H01L21/67109 ,  C23C16/46 ,  C23C16/463

    摘要： A substrate processing apparatus includes a heating part including a cylindrical-shaped heat insulator and a heating wire arranged on the inner circumferential surface of the heat insulator, a heat-insulating part configured to define a cylindrical space between the heating part and the heat insulating part, a cooling gas introduction portion coupled to the cylindrical space and provided above the heat-insulating part to surround the heating part, and a cooling gas discharge portion provided at an approximately same height as that of the cooling gas introduction portion in the diameter direction extending from approximately the center of the cooling gas introduction portion.

    摘要翻译： 一种基板处理装置，包括：加热部，其包括圆筒状的隔热体和配置在隔热材料的内周面上的加热丝;隔热部，被配置为在加热部和绝热部之间限定圆筒状的空间 连接到所述圆筒形空间并设置在所述绝热部分上方以围绕所述加热部的冷却气体导入部，以及设置在与所述冷却气体导入部的直径方向延伸大致相同的高度的冷却气体排出部 从大致冷却气体导入部的中心开始。

    Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device
    7.
    发明授权
    Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device 有权
    温度检测装置，基板处理装置及半导体装置的制造方法

    公开(公告)号：US08822240B2

    公开(公告)日：2014-09-02

    申请号：US13536418

    申请日：2012-06-28

    申请人： Tetsuya Kosugi ,  Masaaki Ueno ,  Hideto Yamaguchi

    发明人： Tetsuya Kosugi ,  Masaaki Ueno ,  Hideto Yamaguchi

    IPC分类号： G01R31/26 ,  H01L21/66 ,  G01K1/12 ,  H01L21/67 ,  G01K7/04 ,  G01K7/02

    CPC分类号： H01L22/10 ,  C23C16/0209 ,  G01K1/12 ,  G01K7/026 ,  G01K7/04 ,  G01K13/02 ,  G01K2013/024 ,  H01L21/67248 ,  H01L22/30 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.

    摘要翻译： 提供一种温度检测装置，其能够抑制由于随时间的变化而导致的热电偶线的断开或热电偶接合部的位置偏离。 温度检测装置包括：安装成沿垂直方向延伸并且在垂直方向上包括通孔的绝缘杆; 插入所述绝缘棒的通孔中的热电偶线，所述热电偶线在其上端包括热电偶接合部分和所述绝缘棒的下端处的倾斜部分; 以及安装在所述绝缘杆下方的缓冲区，并且被构造成在热膨胀时抑制所述成角度部分的水平部分的限制，其中所述热电偶线的上部或所述垂直方向上的中间部分由所述绝缘杆支撑。