公开(公告)号：US20240151665A1

公开(公告)日：2024-05-09

申请号：US18282624

申请日：2021-03-29

Applicant: Hitachi High-Tech Corporation

Inventor： Yohei NAKAMURA ,  Naoko TAKEDA ,  Natsuki TSUNO ,  Satoshi TAKADA ,  Heita KIMIZUKA

IPC: G01N23/2251 ,  H01J37/26

CPC classification number: G01N23/2251 ,  H01J37/265 ,  G01N2223/6116 ,  H01J2237/24564 ,  H01J2237/2806

Abstract: Provided is an inspection system capable of estimating electric characteristics of a sample with high accuracy regardless of an initial charging state of a wafer. The inspection system includes a charged particle beam device and a computer system, and inspects the electric characteristics of the sample. The inspection system evaluates initial charging of an inspection region including inspection patterns based on reference data indicating a secondary charged particle signal from a reference pattern corresponding to a plurality of pulse conditions. The reference pattern has the same electric characteristics as the inspection pattern and initial charging therein caused by electric charges that are not emitted according to a discharge time constant of the sample is negligible. The reference pattern is obtained by irradiating the reference pattern with a pulse charged particle beam under a plurality of pulse conditions.

公开(公告)号：US20230369012A1

公开(公告)日：2023-11-16

申请号：US18029004

申请日：2020-09-30

Applicant: Hitachi High-Tech Corporation

Inventor： Naoko TAKEDA ,  Natsuki TSUNO ,  Satoshi TAKADA ,  Yuto HATTORI

IPC: H01J37/22 ,  H01J37/28 ,  H01J37/244 ,  H01J37/20

CPC classification number: H01J37/222 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28

Abstract: Provided is a technique and the like capable of specifying irradiation areas or irradiation positions of a beam and a light as clearly as possible. A charged particle beam apparatus 1 includes: a position adjustment mark 10 provided on a stage 6 and irradiated with a beam b1 and a light a1; and a mechanism setting an irradiation position of the beam b1 and an irradiation position of the light a1 with respect to the stage 6 and changing a relative positional relationship including a distance between the irradiation position of the light a1 and the stage 6. A computer system 2 generates a first image in which the position adjustment mark 10 is reflected based on a first detection signal obtained by irradiating the position adjustment mark 10 with the beam b1, generates a second image in which an irradiation area of the light a1 is reflected in the vicinity of the position adjustment mark 10 based on a second detection signal obtained by irradiating the position adjustment mark 10 with the light a1, and adjusts an irradiation position of the beam b1 and an irradiation position of the light a1 based on the first image and the second image obtained when a positional relationship is changed by the mechanism.