公开(公告)号：US06575354B2

公开(公告)日：2003-06-10

申请号：US09986478

申请日：2001-11-08

申请人： Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

发明人： Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

IPC分类号： B23K3102

CPC分类号： H01L23/49582 ,  C25D3/60 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85011 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210° C.

摘要翻译： 本发明涉及一种具有优异润湿性和改善焊接性的锡 - 银合金电镀膜的制造方法，所述方法包括对锡 - 银合金镀膜表面进行热处理的步骤，优选热处理温度为70℃ -210℃

公开(公告)号：US06677056B2

公开(公告)日：2004-01-13

申请号：US10274033

申请日：2002-10-21

申请人： Hisahiro Tanaka ,  Matsuo Masuda

发明人： Hisahiro Tanaka ,  Matsuo Masuda

IPC分类号： B32B1501

CPC分类号： H01L23/49582 ,  B32B15/01 ,  C22C13/00 ,  C25D3/60 ,  C25D5/18 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  Y10S428/935 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not more than 500 ms and a stopping period of not less than 1 ms and not more than 500 ms with a proviso that the stopping period is equal to or shorter than the passing period.

摘要翻译： 通过使用电流通过期间不小于3ms且不大于500ms的脉冲波形的电流的电镀工艺制造可提高焊接性和挠曲裂纹特性的锡 - 银合金电镀膜，以及 停止期间不小于1ms且不大于500ms，条件是停止期间等于或短于通过期间。

公开(公告)号：US06646330B2

公开(公告)日：2003-11-11

申请号：US09953915

申请日：2001-09-18

申请人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

发明人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

IPC分类号： H01L23495

CPC分类号： H01L21/4821 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at least one member selected from the group consisting of nickel, copper, iron and (nickel and copper and iron), ii. an inner lead part having a surface treated layer A, the surface treated layer A comprising silver or an alloy comprising silver, and iii. an outer lead part having a surface treated layer B, the surface treated layer B comprising silver and tin, or copper and tin, wherein the surface treated layer B has on its surface an oxidized layer comprising tin and oxygen, the atomic ratio of oxygen to tin in the oxidized layer is 0.5-1.8 and the thickness of the layer is not more than 20 nm.

摘要翻译： 本发明涉及一种用于半导体器件的引线框架，其具有改善焊料润湿性的外引线部分，其包括： 包括含有选自镍，铜，铁和（镍和铜和铁）中的至少一种的合金的基体），ii。 具有表面处理层A的内部引线部分，表面处理层A包含银或包含银的合金和iii。 具有表面处理层B的外部引线部分，包含银和锡的表面处理层B或铜和锡，其中表面处理层B在其表面上具有包含锡和氧的氧化层，氧与原子比 氧化层中的锡为0.5-1.8，层的厚度不大于20nm。

公开(公告)号：US06395583B1

公开(公告)日：2002-05-28

申请号：US09548351

申请日：2000-04-12

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L2144

CPC分类号： H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A lead frame made from Ni, a Ni alloy, Cu, a Cu alloy, Fe or an Fe alloy, comprising an inner lead part with a surface treatment layer of Ag or a Ag-containing alloy and an outer lead part with a surface treatment layer of an alloy containing Ag and Sn, wherein the latter surface treatment layer has a brightness of not less than 0.6 and Sn has the body-centered tetragonal lattice with the crystal orientation indices of from 1.5 to 5 at the (220) plane, not more than 0.9 at the (211) plane and not less than 0.5 at the (200) plane. The surface treatment layer is plated with utilization of a plating solution which contains one or more selected from alkane sulfonic acid, alkanol sulfonic acid and sulfamine acid as the acid component, one or more of tin methane-sulfonate and SnO as a tin salt, and one or more slected from silver methane-sulfonate, Ag2O and AgO as a silver salt. The outer lead part may be subjected to a preliminary etching treatment with utilization of a treatment agent of one or more selected from chloric acid, nitric acid and sulfic acid prior to forming the surface treatment layer. The formed surface treatment layer may be treated by a treating agent containing sodium triphosphate.

摘要翻译： 由Ni，Ni合金，Cu，Cu合金，Fe或Fe合金制成的引线框架，包括具有Ag或含Ag合金的表面处理层的内部引线部分和具有表面处理的外部引线部分 含有Ag和Sn的合金层，其中后表面处理层具有不小于0.6的亮度，并且Sn具有在（220）面处晶体取向指数为1.5至5的体心四方晶格，而不是 （211）面上大于0.9，（200）面不大于0.5。 使用含有选自烷烃磺酸，链烷醇磺酸和磺胺酸中的一种或多种作为酸成分的电镀溶液，一种或多种锡 - 甲磺酸锡和SnO作为锡盐，对所述表面处理层进行镀覆，以及 从银甲磺酸银，Ag2O和AgO中选择一种或多种作为银盐。 在形成表面处理层之前，可以利用选自氯酸，硝酸和硫酸的一种或多种处理剂对外部引线部进行预蚀刻处理。 形成的表面处理层可以通过含有三磷酸钠的处理剂进行处理。

公开(公告)号：US6087714A

公开(公告)日：2000-07-11

申请号：US298841

申请日：1999-04-26

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/48 ,  H01L23/49582 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181

摘要： In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

摘要翻译： 在由选自镍和镍合金，铜和铜合金以及铁和铁合金中的至少一种金属形成的引线框架中，内部引线部分设置有Ag或含有银的合金的表面处理层 并且所述外引线部分至少设置有在（101）面和/或（211）面中优先取向的体心立方结构的含有银和锡的合金的表面处理层。 根据上述结构，使用不含有铅的电子部件用引线框的半导体装置，其中一种对环境有害的污染物具有焊料润湿性和接合强度等特性，成本低，成本低的方法 提供生产设备。

公开(公告)号：US06159623A

公开(公告)日：2000-12-12

申请号：US82550

申请日：1998-05-21

申请人： Hisahiro Tanaka

发明人： Hisahiro Tanaka

IPC分类号： C25D3/50 ,  C25D3/52 ,  C25D7/12 ,  H01L23/50 ,  B32B15/01

CPC分类号： C25D3/52 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10T428/12875 ,  H01L2924/00014 ,  H01L2924/00

摘要： A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a palladium plating solution. The palladium plating film can be used, for example, for the plating of electrical and electronic parts. The palladium plating solution used contains a soluble palladium salt and a quaternary compound, and, if necessary, further contains a pyridine derivative or a salt thereof, and optionally further contains at least one compound selected from ammonium chloride, ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid or a soluble selenium salt.

摘要翻译： 通过使用钯电镀液制造具有优异焊接特性的钯电镀膜，其具有优异的焊料润湿性，高焊锡润湿速度，特别是在高温气氛中维持这些特性。 钯电镀膜可以用于例如电气和电子部件的电镀。 使用的镀钯溶液含有可溶性钯盐和季铵化合物，如果需要，还含有吡啶衍生物或其盐，并且任选地还含有至少一种选自氯化铵，磷酸氢铵，硝酸铵，铵 硫酸盐，氯化铵和硼酸或可溶性硒盐。

公开(公告)号：US07689255B2

公开(公告)日：2010-03-30

申请号：US11706961

申请日：2007-02-16

申请人： Seiji Kurauchi ,  Toshiaki Kobayashi ,  Yuichiro Nishioka ,  Hiroyuki Arai ,  Hisahiro Tanaka

发明人： Seiji Kurauchi ,  Toshiaki Kobayashi ,  Yuichiro Nishioka ,  Hiroyuki Arai ,  Hisahiro Tanaka

IPC分类号： H04M1/00

CPC分类号： G11B31/00 ,  B60R11/02 ,  B60R11/0247 ,  B60R11/0264 ,  B60R2011/008 ,  B60R2011/0294 ,  G11B33/027 ,  H04M1/6091

摘要： An in-vehicle apparatus including: an apparatus body; a front surface of the apparatus body; and a lid configured to open and close the front surface. A microphone directed to the front side of the front surface in the condition where the lid is opened is provided at the front surface of the apparatus body. A gap for communication between the location, where the microphone is provided, of the front surface and the outside is secured between the front surface and the lid in the condition where the front surface of the apparatus body is closed with the lid.

摘要翻译： 一种车载设备，包括：设备主体; 设备主体的前表面; 以及构造成打开和关闭前表面的盖子。 在打开盖子的状态下，指向前表面前侧的麦克风设置在装置本体的前表面。 在装置主体的前表面用盖子关闭的状态下，前表面和外侧之间的麦克风位置之间的通信间隙被固定在前表面和盖子之间。

公开(公告)号：US07494100B2

公开(公告)日：2009-02-24

申请号：US10990248

申请日：2004-11-16

申请人： Takehiko Tanaka ,  Hisahiro Tanaka

发明人： Takehiko Tanaka ,  Hisahiro Tanaka

IPC分类号： A47F5/00

CPC分类号： B60R11/0235 ,  B60R2011/0085 ,  B60R2011/0092 ,  Y10S248/919

摘要： A torsion coil spring spring-biases a rotary plate in such direction that a display unit may be rotated around rotary shafts, so as to rise from a horizontal position. An extension spring spring-biases the display unit, so that the display unit may be changed from an anti-rising direction to a rising direction while the display unit is being rotated, whereby a driving torque may become substantially constant against the weight of the display unit. One end of the extension spring is engaged with the rotary plate and the other end thereof is engaged with an engagement pin disposed at a position displaced from the center of the rotary shaft of the display unit. The length of the extension spring becomes longest while the rotary plate is being tilted and rotated. Thus, the electronic equipment tilting and rotating apparatus can tilt and rotate the display unit with application of a necessary and minimum driving torque.

摘要翻译： 扭转螺旋弹簧弹簧以使显示单元绕旋转轴旋转的方向偏压旋转板，从而从水平位置上升。 延伸弹簧弹簧偏压显示单元，使得显示单元可以在显示单元旋转时从反向上升方向改变到上升方向，由此驱动扭矩可以相对于显示器的重量变得基本恒定 单元。 拉伸弹簧的一端与旋转板接合，另一端与设置在从显示单元的旋转轴的中心偏移的位置处的接合销接合。 延伸弹簧的长度在旋转板倾斜旋转时变长。 因此，电子设备倾斜和旋转装置可以通过施加必要和最小的驱动扭矩来倾斜和旋转显示单元。

公开(公告)号：US20050224689A1

公开(公告)日：2005-10-13

申请号：US10990248

申请日：2004-11-16

申请人： Takehiko Tanaka ,  Hisahiro Tanaka

发明人： Takehiko Tanaka ,  Hisahiro Tanaka

IPC分类号： B60R11/00 ,  B60R11/02 ,  G09F9/00 ,  H05K5/02 ,  E02F3/00

CPC分类号： B60R11/0235 ,  B60R2011/0085 ,  B60R2011/0092 ,  Y10S248/919

摘要： A torsion coil spring spring-biases a rotary plate in such direction that a display unit may be rotated around rotary shafts, so as to rise from a horizontal position. An extension spring spring-biases the display unit, so that the display unit may be changed from an anti-rising direction to a rising direction while the display unit is being rotated, whereby a driving torque may become substantially constant against the weight of the display unit. One end of the extension spring is engaged with the rotary plate and the other end thereof is engaged with an engagement pin disposed at a position displaced from the center of the rotary shaft of the display unit. The length of the extension spring becomes longest while the rotary plate is being tilted and rotated. Thus, the electronic equipment tilting and rotating apparatus can tilt and rotate the display unit with application of a necessary and minimum driving torque.

摘要翻译： 扭转螺旋弹簧弹簧以使显示单元绕旋转轴旋转的方向偏压旋转板，从而从水平位置上升。 延伸弹簧弹簧偏压显示单元，使得显示单元可以在显示单元旋转时从反向上升方向改变到上升方向，由此驱动扭矩可以相对于显示器的重量变得基本恒定 单元。 拉伸弹簧的一端与旋转板接合，另一端与设置在从显示单元的旋转轴的中心偏移的位置处的接合销接合。 延伸弹簧的长度在旋转板倾斜旋转时变长。 因此，电子设备倾斜和旋转装置可以通过施加必要和最小的驱动扭矩来倾斜和旋转显示单元。

公开(公告)号：US07488408B2

公开(公告)日：2009-02-10

申请号：US11184079

申请日：2005-07-19

申请人： Hisahiro Tanaka ,  Shigeki Ogata

发明人： Hisahiro Tanaka ,  Shigeki Ogata

IPC分类号： C25D5/50 ,  C25D3/30

CPC分类号： H01L23/49582 ,  C25D5/505 ,  C25F3/02 ,  H01L2224/32245 ,  H01L2924/15173 ,  Y10S428/929 ,  Y10T428/12715

摘要： The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

摘要翻译： 本发明的目的是提供一种镀锡膜及其制造方法，其能够防止产生晶须，同时防止未被镀锡膜覆盖的基板表面 ，由于氧化引起的变色，通过其可以防止晶须生成的抑制，晶须生长的抑制以及防止被镀基板的变色，从而确保了优异的生产率。 该方法具有以下步骤：去除在铜或铜合金上形成的一部分镀锡膜; 处理以防止除去镀锡膜的铜或铜合金的变色; 并对被加工成防止变色的铜或铜合金的镀锡膜施加热能。