公开(公告)号：US4695504A

公开(公告)日：1987-09-22

申请号：US875872

申请日：1986-06-18

Applicant: Hirotoshi Watanabe ,  Osamu Makino ,  Toru Ishida

Inventor： Hirotoshi Watanabe ,  Osamu Makino ,  Toru Ishida

IPC: H01C17/065 ,  B32B3/00 ,  H01B1/06

CPC classification number: H01C17/0656 ,  H01C17/0658 ,  H01C17/06593 ,  Y10S428/901 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A thick film resistor composition, comprising a silicide powder composed of a molybdenum disilicide, a tantalum disilicide and a magnesium silicide, and an alkaline earth borosilicate glass powder dispersed in a vehicle containing a heat-depolymerizing organic polymer. The thick film resistor composition, employing this heat-depolymerizing organic polymer, can be fired in a nonoxidizing atmosphere and coexist with base metal materials such as copper electrodes. Owing to the Nb.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 contained in the alkaline earth borosilicate glass powder, the thick film resistor composition is free from sheet resistivity fluctuation, according to resistor length, which would result from diffusion of the electrode material into the resistor.

Abstract translation: 一种厚膜电阻组合物，包括由二硅化钼，二硅化硅和硅化镁组成的硅化物粉末和分散在含有热解聚有机聚合物的载体中的碱土金属硼硅玻璃粉末。 使用该热解聚有机聚合物的厚膜电阻组合物可以在非氧化气氛中烧制，并与诸如铜电极的贱金属材料共存。 由于碱土金属硼硅酸盐玻璃粉末中含有的Nb 2 O 5和Ta 2 O 5，根据由电极材料扩散到电阻器中的电阻器长度，厚膜电阻组合物没有电阻率波动。

公开(公告)号：US4985377A

公开(公告)日：1991-01-15

申请号：US281025

申请日：1988-12-07

Applicant: Takeshi Iseki ,  Osamu Makino ,  Mitsuo Ioka ,  Hirotoshi Watanabe

Inventor： Takeshi Iseki ,  Osamu Makino ,  Mitsuo Ioka ,  Hirotoshi Watanabe

IPC: H01C7/00 ,  H01C17/065

CPC classification number: H01C17/06566 ,  H01C17/0656 ,  H01C7/003

Abstract: The invention relates to glaze resistors which are used for electronic parts of hybrid integrated circuit devices, chip resistors, resistor network, etc. The glaze resistor comprises 4.0 to 70.0 wt % of a conductive component composed of a metal silicide and a metal boride and 30.0 to 96.0 wt % of glass in which a rate of said metal boride is 1.0 to 68.0 wt %. Thus, the glaze resistor can be formed by sintering in a non-oxidizing atmosphere and can provide a circuit, together with conductor pattern of base metals such as Cu.

公开(公告)号：US4714570A

公开(公告)日：1987-12-22

申请号：US756081

申请日：1985-07-17

Applicant: Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

Inventor： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

IPC: C04B41/51 ,  H01B1/20 ,  H01L21/48 ,  H01L23/482 ,  H05K1/09 ,  H01B1/06

CPC classification number: H05K1/092 ,  C04B41/5127 ,  C04B41/5144 ,  H01B1/20 ,  H01L21/4867 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Abstract translation: 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法和以CuO，NiO，CoO或Fe2O3为特征的导体形成膏作为主要成分，将该糊状物施加到多层 身体。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。

公开(公告)号：US4863683A

公开(公告)日：1989-09-05

申请号：US66182

申请日：1987-06-24

Applicant: Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

Inventor： Seiichi Nakatani ,  Satoru Yuhaku ,  Hideyuki Okinaka ,  Toru Ishida ,  Osamu Makino ,  Tatsuro Kikuchi

IPC: C04B41/51 ,  H01B1/20 ,  H01L21/48 ,  H01L23/482 ,  H05K1/09

CPC classification number: H05K1/092 ,  C04B41/5127 ,  C04B41/5144 ,  H01B1/20 ,  H01L21/4867 ,  H01L23/4828 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

Abstract: A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Abstract translation: 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法，以CuO，NiO，CoO或Fe2O3为特征的导体形成膏为主要成分，将该糊剂涂敷于多层体 。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。

公开(公告)号：US07966858B2

公开(公告)日：2011-06-28

申请号：US12427869

申请日：2009-04-22

Applicant: Osamu Makino

Inventor： Osamu Makino

IPC: B21D5/01 ,  B21D5/02 ,  B21D11/00

CPC classification number: B21D5/0209

Abstract: A bending tool that may be used for bending elongated works and in which the works are not likely to be damaged is provided. An angle formed by a blade parting line L1, L2 and an outside edge of a blade of each die is made larger than an angle formed by the blade parting line L1, L2 and an inside edge. An inner end edge of the bending block of one of dies is chamfered to be parallel to the outside edge of the blade and the inside edge is shorter than the length of the inner end edge 16C, 26C. The blade parting line L1 of one of the dies is located at a position further toward the blade parting line L2 of the other of the dies with respect to the center of the space between the blade parting line and the inner end edge of the bending block.

Abstract translation: 提供了可用于弯曲细长工件并且其中不可能损坏工件的弯曲工具。 由刀片分割线L1，L2和每个模具的刀片的外边缘形成的角度大于由叶片分型线L1，L2和内侧边缘形成的角度。 一个模具的弯曲块的内端边缘被倒角成平行于叶片的外边缘，并且内边缘比内端边缘16C，26C的长度短。 一个模具的刀片分型线L1位于相对于刀片分割线和弯曲块的内端缘之间的空间的中心的另一个模具的刀片分割线L2的位置 。

公开(公告)号：US07078999B2

公开(公告)日：2006-07-18

申请号：US11105646

申请日：2005-04-14

Applicant: Eiichi Uriu ,  Osamu Makino ,  Hironobu Chiba ,  Chisa Yokota

Inventor： Eiichi Uriu ,  Osamu Makino ,  Hironobu Chiba ,  Chisa Yokota

IPC: H01F5/00

CPC classification number: H01F17/0013 ,  H01F41/041 ,  Y10T29/4902 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.

公开(公告)号：US5647966A

公开(公告)日：1997-07-15

申请号：US537512

申请日：1995-10-02

Applicant: Eiichi Uriu ,  Osamu Makino ,  Hironobu Chiba ,  Chisa Yokota

Inventor： Eiichi Uriu ,  Osamu Makino ,  Hironobu Chiba ,  Chisa Yokota

IPC: H01F17/00 ,  H01F41/04 ,  H05K1/03 ,  H05K3/20 ,  C25D1/00

CPC classification number: H01F41/042 ,  H05K3/205 ,  H01F17/0006 ,  H05K1/0306 ,  H05K2203/0117 ,  H05K2203/0726 ,  H05K3/4629

Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.

Abstract translation: 制造导电图案的方法包括以下步骤：在导电基板上形成掩模层，掩模层具有限定导电基板的暴露区域的图案; 通过使用基本上保持掩模层的图案的电镀液进行电铸而在导电基板的暴露区域上形成导电图案; 并且将导电图案转移到支撑层上而不去除掩模层。

公开(公告)号：US3953373A

公开(公告)日：1976-04-27

申请号：US489827

申请日：1974-07-18

Applicant: Mikio Matsuura ,  Osamu Makino ,  Nobuji Nishi ,  Michio Matsuoka

Inventor： Mikio Matsuura ,  Osamu Makino ,  Nobuji Nishi ,  Michio Matsuoka

IPC: H01C7/112 ,  H01B1/08

CPC classification number: H01C7/112

Abstract: A voltage-dependent resistor comprising a sintered body comprising ZnO as a major part and Bi.sub.2 O.sub.3 and GeO.sub.2 as additives with electrodes applied to the opposite surfaces of the sintered body. This voltage-dependent resistor has a low C-value and a high n-value in I=(V/C).sup.n along with high power dissipation for surge energy and high stability to a high D.C. load. Further, other additives such as NiO, Co.sub.2 O.sub.3, MnO, TiO.sub.2 and Cr.sub.2 O.sub.3 can advantageously be added to the sintered body.

Abstract translation: 一种电压依赖电阻器，包括以ZnO作为主要部分的烧结体，Bi 2 O 3和GeO 2作为添加剂，其电极施加到烧结体的相对表面。 该电压相关电阻在I =（V / C）n中具有低C值和高n值，同时具有用于浪涌能量的高功耗和高直流负载的高稳定性。 此外，可以有利地将其它添加剂如NiO，Co2O3，MnO，TiO2和Cr2O3添加到烧结体中。

公开(公告)号：US07100440B2

公开(公告)日：2006-09-05

申请号：US11118114

申请日：2005-04-29

Applicant: Tatsuhide Morisawa ,  Hiroshi Momozane ,  Osamu Makino

Inventor： Tatsuhide Morisawa ,  Hiroshi Momozane ,  Osamu Makino

IPC: G01F1/68

CPC classification number: G01F1/6842 ,  G01F1/6845 ,  G01F1/6847

Abstract: A compact and light flow meter having a rapid response includes a main body having a groove portion opened in the upper portion and also having connecting portions for communicating the groove portion and the exterior at both ends of the groove portion; a detachable cover body sealing the opened upper portion of the groove portion having a rectangular sectional shape in which a measured fluid is flowed; and a circuit substrate coming in close contact with the external face of the cover body. A sensor hole opened to the measuring chamber is arranged in the cover body; and a flow sensor is arranged in the circuit substrate so as to be arranged within the sensor hole and set a detecting face to face the measuring chamber.

Abstract translation: 具有快速响应的紧凑型轻型流量计包括：主体，其具有在上部开口的槽部，并且还具有用于在槽部的两端连通槽部和外部的连接部; 密封所述开口的所述槽部的上部的可拆卸盖体，所述上部具有测量流体流动的矩形截面形状; 以及与盖体的外表面紧密接触的电路基板。 在盖体上设置有向测量室开口的传感器孔; 并且流量传感器布置在电路基板中以便布置在传感器孔内并且设置检测面以面对测量室。

公开(公告)号：US20050241388A1

公开(公告)日：2005-11-03

申请号：US11118114

申请日：2005-04-29

Applicant: Tatsuhide Morisawa ,  Hiroshi Momozane ,  Osamu Makino

Inventor： Tatsuhide Morisawa ,  Hiroshi Momozane ,  Osamu Makino

IPC: G01F1/684 ,  G01F1/68

CPC classification number: G01F1/6842 ,  G01F1/6845 ,  G01F1/6847

Abstract: A compact and light flow meter having a rapid response includes a main body having a groove portion opened in the upper portion and also having connecting portions for communicating the groove portion and the exterior at both ends of the groove portion; a detachable cover body sealing the opened upper portion of the groove portion having a rectangular sectional shape in which a measured fluid is flowed; and a circuit substrate coming in close contact with the external face of the cover body. A sensor hole opened to the measuring chamber is arranged in the cover body; and a flow sensor is arranged in the circuit substrate so as to be arranged within the sensor hole and set a detecting face to face the measuring chamber.

Abstract translation: 具有快速响应的紧凑型轻型流量计包括：主体，其具有在上部开口的槽部，并且还具有用于在槽部的两端连通槽部和外部的连接部; 密封所述开口的所述槽部的上部的可拆卸盖体，所述上部具有测量流体流动的矩形截面形状; 以及与盖体的外表面紧密接触的电路基板。 在盖体上设置有向测量室开口的传感器孔; 并且流量传感器布置在电路基板中以便布置在传感器孔内并且设置检测面以面对测量室。