公开(公告)号：US20240107656A1

公开(公告)日：2024-03-28

申请号：US18372828

申请日：2023-09-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Fei MA ,  Wei FANG ,  Zhiwen YANG ,  Chungang LI ,  Shun HAO

IPC: H05K1/02 ,  G02B6/42 ,  H05K1/18 ,  H05K7/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  G02B6/4269 ,  G02B6/4284 ,  H05K1/181 ,  H05K7/023 ,  H05K7/026 ,  H05K7/20409

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

公开(公告)号：US20210212193A1

公开(公告)日：2021-07-08

申请号：US17155324

申请日：2021-01-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Fei MA ,  Wei FANG ,  Zhiwen YANG ,  Chungang LI ,  Shun HAO

IPC: H05K1/02 ,  G02B6/42 ,  H05K1/18 ,  H05K7/02 ,  H05K7/20

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

公开(公告)号：US20240357773A1

公开(公告)日：2024-10-24

申请号：US18758053

申请日：2024-06-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zelong JIAO ,  Lujun ZHOU ,  Guangming ZHENG ,  Fei MA

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20727

Abstract: The technology of this application relates to, at least, a cooling module. The cooling module includes a liquid mixing cavity, a first and a second cooling plate. The first cooling plate is disposed on a side of a first chip and is fastened to the first chip. The second cooling plate is disposed on a side of a second chip and is fastened to the second chip. A temperature of the first chip is not equal to a temperature of the second chip. A flow channel is provided in each of the first cooling plate and the second cooling plate. The first cooling plate and the second cooling plate are each provided with a liquid outlet and a liquid return opening that are communicated with the flow channel. Both the liquid outlet and the liquid return opening are communicated with the liquid mixing cavity. A liquid medium flows between the flow channel and the liquid mixing cavity.