公开(公告)号：US20240357773A1

公开(公告)日：2024-10-24

申请号：US18758053

申请日：2024-06-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zelong JIAO ,  Lujun ZHOU ,  Guangming ZHENG ,  Fei MA

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20727

Abstract: The technology of this application relates to, at least, a cooling module. The cooling module includes a liquid mixing cavity, a first and a second cooling plate. The first cooling plate is disposed on a side of a first chip and is fastened to the first chip. The second cooling plate is disposed on a side of a second chip and is fastened to the second chip. A temperature of the first chip is not equal to a temperature of the second chip. A flow channel is provided in each of the first cooling plate and the second cooling plate. The first cooling plate and the second cooling plate are each provided with a liquid outlet and a liquid return opening that are communicated with the flow channel. Both the liquid outlet and the liquid return opening are communicated with the liquid mixing cavity. A liquid medium flows between the flow channel and the liquid mixing cavity.