公开(公告)号：US20240107656A1

公开(公告)日：2024-03-28

申请号：US18372828

申请日：2023-09-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Fei MA ,  Wei FANG ,  Zhiwen YANG ,  Chungang LI ,  Shun HAO

IPC: H05K1/02 ,  G02B6/42 ,  H05K1/18 ,  H05K7/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  G02B6/4269 ,  G02B6/4284 ,  H05K1/181 ,  H05K7/023 ,  H05K7/026 ,  H05K7/20409

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

公开(公告)号：US20210212193A1

公开(公告)日：2021-07-08

申请号：US17155324

申请日：2021-01-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Fei MA ,  Wei FANG ,  Zhiwen YANG ,  Chungang LI ,  Shun HAO

IPC: H05K1/02 ,  G02B6/42 ,  H05K1/18 ,  H05K7/02 ,  H05K7/20

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.